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Número de pieza | BS-115C | |
Descripción | Miniature Relay | |
Fabricantes | Bestar | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de BS-115C (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! BS-115Cwww.DataSheet4U.McomINIATURE RELAY
Features
● Ultra-miniature size (18.8 *15.4 *15.1 mm)
● High Switching Capacity up to 12A
● UL File No. E147052
● CSA File No. LR76479-1
● TUV File No. R9754066
Nominal
Voltage
(VDC)
3
5
6
9
12
24
48
Coil
Resistance
(Ω ± 10%)
25
70
100
220
400
1600
6400
Coil Rating (at 20°C)
Nominal
Current
(mA)
Pick-Up
Voltage
(VDC)
120 2.25
72 3.75
60 4.50
40 6.75
30 9.00
15 18.00
7.5 36.00
Drop-Out
Voltage
(VDC)
0.3
0.5
0.6
0.9
1.2
2.4
4.8
Nominal Power
(mW)
Consumption
360
Ordering Information
● BS – 115C S–A–12A–12VDC
Protection
Nil: Flux Free
S: Sealed
Contact Arrangement.
Nil: 1 From C
A: 1 From A
Contact Rating
7A
12A
Coil Voltage
See Coil Rating
JM Elektronik
Ul. Karolinki 58
44-100 Gliwice
tel: +48 32 339 69 00
fax: +48 32 339 69 09
e-mail: [email protected]
Strona 1 z 6
1 page www.DataSheet4U.com
Process
1. Mounting of Relay
Relay Soldering and Washing Guidelines
Guidelines
• Avoid bending the terminals to make the relay self-clinching. Relay performance cannot
be guaranteed if the terminals are bent.
2. Flux Coating
3. Preheating
4. Soldering
• Adjust the position of the PC board so that flux does not overflow onto the top of it.
• Use rosin-based flux, which is non-corrosive and requires no washing.
• Do not use Automatic Flux Coating Method to dust-covertype relays.
• Do not overflow onto the top of PC Board, in such a case the flux
• may even penetrate a flux-resistant type relay.
• Be sure to preheat before soldering.
• Preheating acts to improve solderability.
• Preheat according to the following conditions.
Temperature
Time
100°C / 212°F or less
Within approx. 1 minute
• Note that long exposure to high temperatures (e.g. due to a malfunctioning unit) may
affect relay characteristics.
Automatic Soldering
• Flow solder is the optimum method for soldering.
• Adjust the level of solder so that it does not overflow onto the top ofthe PC board.
• Unless otherwise specified, solder under the following conditions depending on the type
of relay.
Solder Temperature Approx. 250°C / 482°F
Soldering Time Within approx. 5 seconds
Solder Ratio
Sn/Pb = 60/40 or 63/37
Hand Soldering
• Keep the tip of the soldering iron clean.
Solder Iron
30W to 60W
Iron Tip Temperature Approx. 300°C / 573°F
Solder Time
Withinapprox. 3 seconds
JM Elektronik
Ul. Karolinki 58
44-100 Gliwice
tel: +48 32 339 69 00
fax: +48 32 339 69 09
e-mail: [email protected]
Strona 5 z 6
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet BS-115C.PDF ] |
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BS-115C | Miniature Relay | Bestar |
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