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PDF BTB1424N3 Data sheet ( Hoja de datos )
| Número de pieza | BTB1424N3 | |
| Descripción | Low VCE(sat) PNP Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
Low VCE(sat) PNP Epitaxial Planar Transistor
BTB1424N3
Spec. No. : C817N3-R
Issued Date : 2003.04.03
Revised Date :2004.09.30
Page No. : 1/5
Features
• Excellent DC current gain characteristics
• Low Saturation Voltage
VCE(sat)=-0.3V(typ)(IC=-2A, IB=-100mA).
• Complementary to BTD2150N3
• Pb-free package
Symbol
BTB1424N3
Outline
SOT-23
B：Base
C：Collector
E：Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current(DC)
Collector Current(Pulsed)(Note 1)
Power Dissipation
Thermal Resistance, Junction to Ambient
Junction Temperature
Storage Temperature
Note 1: Single pulse, Pw≤10ms, Duty Cycle≤30%.
Symbol
VCBO
VCEO
VEBO
IC
ICP
Pd
RθJA
Tj
Tstg
Limits
-50
-50
-5
-3
-7
225
556
150
-55~+150
Unit
V
V
V
A
mW
°C/W
°C
°C
BTB1424N3
CYStek Product Specification
1 page  
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CYStech Electronics Corp.
SOT-23 Dimension
Spec. No. : C817N3-R
Issued Date : 2003.04.03
Revised Date :2004.09.30
Page No. : 5/5
A
L
Marking:
3
S
B
12
ATE
VG
C
D
H
KJ
3-Lead SOT-23 Plastic
Surface Mounted Package
CYStek Package Code: N3
Style: Pin 1.Base 2.Emitter 3.Collector
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A 0.1102 0.1204 2.80 3.04
B 0.0472 0.0630 1.20 1.60
C 0.0335 0.0512 0.89 1.30
D 0.0118 0.0197 0.30 0.50
G 0.0669 0.0910 1.70 2.30
H 0.0005 0.0040 0.013 0.10
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
J 0.0034 0.0070 0.085 0.177
K 0.0128 0.0266 0.32 0.67
L 0.0335 0.0453 0.85 1.15
S 0.0830 0.1083 2.10 2.75
V 0.0098 0.0256 0.25 0.65
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB1424N3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTB1424N3.PDF ] | |
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