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PDF ESDA14V2-1BF3 Data sheet ( Hoja de datos )
| Número de pieza | ESDA14V2-1BF3 | |
| Descripción | TVS Clamping Array | |
| Fabricantes | ST Microelectronics | |
| Logotipo |  |
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ESDA14V2-1BF3
Single-line bidirectional Transil™ array for ESD protection
Features
■ ESD Protection: IEC61000-4-2 level 4
■ Low leakage current
■ Very small PCB area < 0.4 mm²
■ 400 micron pitch
Complies with the following standards
■ IEC61000-4-2 level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
Applications
Where transient overvoltage protection of ESD
sensitive equipment is required, such as:
■ Computers
■ Printers
■ Communications systems and cellular phones
■ Video equipment
Description
The ESDA14V2-1BF3 is a monolithic bidirectional
diode designed to protect 1 line against ESD
transients.
The device is ideally suited for applications where
both reduced line capacitance and board space
saving are required.
Flip Chip
(2 bumps)
Figure 1. Schematic diagram (top view)
June 2009
TM: Transil is a trademark of STMicroelectronics
Doc ID 15894 Rev 1
1/9
www.st.com
9
1 page  
www.DataSEhSeeDt4AU1.c4oVm2-1BF3
3 Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 12. Package dimensions
0.69 mm ±30 µm
0.40 mm ±40 µm
0.36 mm ±45 µm
Figure 13. Flip Chip tape and reel specification
0.20 ± 0.05
2.0 ± 0.05 4.0 ± 0.1
Ø 1.55 ± 0.05
0.43 ± 0.1
All dimensions in mm
0.57 ± 0.05
2.0 ± 0.1
User direction of unreeling
Doc ID 15894 Rev 1
5/9
5 Page | ||
| Páginas | Total 9 Páginas | |
| PDF Descargar | [ Datasheet ESDA14V2-1BF3.PDF ] | |
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