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PDF uP7706 Data sheet ( Hoja de datos )

Número de pieza uP7706
Descripción 3A Ultra Low Dropout Linear Regulator
Fabricantes uPI Semiconductor 
Logotipo uPI Semiconductor Logotipo



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No Preview Available ! uP7706 Hoja de datos, Descripción, Manual

uP7706
3A Ultra Low Dropout Linear Regulator
General Description
Features
The uP7706 is a 3A ultra low dropout linear regulator
specifically designed for motherboard and notebook
applications. This device works with dual supplies, a control
input for the control circuitry and a power input as low as
1.2V for providing current to output. The uP7706 delivers
high-current and ultra-low-drop output voltage as low as
0.8V for applications where VOUT is very close to VIN.
The uP7706 features comprehensive control and protection
functions: a power on reset (POR) circuit for monitoring
both control and power inputs for proper operation; an EN
input for enabling or disabling the device, a power OK with
time delay for indicating the output voltage status, a
foldback current limit function, and a thermal shutdown
function.
The uP7706 is available in PSOP-8 or VDFN6x5-8L
packages with very low thermal resistance.
Applications
† Desktop PCs, Notebooks, and Workstations
† Graphic Cards
† Low Voltage Logic Supplies
† Microprocessor and Chipset Supplies
† Split Plane Microprocessor Supplies
† Advanced Graphics Cards Supplies
† SoundCards and Auxiliary Power Supplies
† SMPS Post Regulators
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† Works with 1.2~5.5V VIN
„ Adjustable Output Voltage, Down to 0.8V
„ 1.5% Initial Accuracy
„ Excellent Line and Load Regulation
† 3A Guaranteed Output Current
„ 200mV @ 2A Dropout Voltage
† Very Low On-Resistance
„ 100mtypical
† VOUT Pull Low Resistance when Disabled
† Low Reverse Leakage (Output to Input )
† VOUT Power OK Signal
† Fast Transient Response
† Low External Component Count
† Low Cost and Easy to Use
† Enable Pin
† Over Current and Over Temperature Protection
Ordering Information
Order Number Package Type
Remark
uP7706U8
PSOP-8
uP7706ADC8 VDFN6x5 - 8L
Note: uPI products are compatible with the current IPC/
JEDEC J-STD-020 and RoHS requirements. They are
100% matte tin (Sn) plating and suitable for use in SnPb
or Pb-free soldering processes.
Pin Configuration & Typical Application Circuit
POK
EN
VIN
CNTL
18
27
GND
36
45
PSOP-8
GND
FB
VOUT
NC
POK 1
EN 2
VIN 3
CNTL 4
GND
8 GND
7 FB
6 VOUT
5 NC
DFN6x5-8L
5VCC
C1
0.1uF
VIN
C2
22uF
CNTL
EN
2
4
POK
1
VIN
3
VOUT
6
FB
7
8
GND
R3
10K
R2
12.5K
R1
10K
VOUT
C4
option
C3
100uF
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. F00, File Name: uP7706-DS-F0000
1

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uP7706 pdf
uP7706
Electrical Characteristics
Parameter
Symbol
Test Conditions
Feedback Voltage
Reference Voltage
Feedback Input Current
VIN Line Regulation
VCNTL Line Regulation
Load Regulation
Load Regulation over
Temperature
Dropout Voltage
VOUT Pull Low Resistance
VREF
VCNTL = VIN = VEN = 5.0V, IOUT = 0A. VOUT = VREF
IFB
VREF(LINE)
1.2V < VIN < 5.0V, VCNTL = VEN = 5.0V, IOUT = 0A. VOUT =
VREF
VREF(CNTL) VIN = 3.3V, IOUT = 0A. VOUT = VREF
VREF(LOAD) 10mA < IOUT < 3A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF
VREF(LOAD)
10mA < IOUT < 3A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF,
-40OC < TJ < 125OC
VDROP
IOUT = 2A, VCNTL = VEN = 5.0V, VOUT = VREF
I OUT = 3A, VCNTL = VEN = 5.0V, VOUT = VREF
VCNTL = VIN = 5.0V, VEN = 0V,
Enable
Enable High Level
Disable Low Level
EN Input Current
EN Input Impedance
PWROK
VEN
VSD
IEN
ZEN
VEN = VCNTL = 5.0V
FB Power OK Threshold
Power OK Hysteresis
Overcurrent Protection
VPOKTH
VPOKHYS
IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF
IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF
OCP Threshold Level
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Current
Thermal Protection
IOCP
ISC
VCNTL = VIN = VEN = 5.0V, VOUT = VREF
VCNTL = VIN = VEN = 5.0V, VOUT = VREF
Thermal Shutdown
Temperature
Thermal Shutdown
Hysteresis
TSD
TSDHYS
IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF
IOUT = 0A, VCNTL = VIN = VEN = 5.0V, VOUT = VREF
Min Typ Max Units
0.788 0.8 0.812
-- 20 --
V
nA
-- 0.01 0.1 %/V
-- 0.01 0.1 %/V
-- 0.8 1.5 %/A
-- 1.4 3
%
-- 200 240
mV
300 360
-- 90 --
-- -- 1.4 V
0.8 --
--
V
-- 12 20 uA
-- 65 -- K
-- 92 --
-- 8
--
%
%
-- 4
--
-- 100 --
A
mA
-- 170 --
-- 30 --
OC
OC
Note 1. Stresses listed as the above Absolute Maximum Ratingsmay cause permanent damage to the device.
These are for stress ratings. Functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may remain possibility to affect device reliability.
Note 2. Devices are ESD sensitive. Handling precaution recommended.
Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. F00, File Name: uP7706-DS-F0000
5

5 Page





uP7706 arduino
0.76 REF
PSOP-8 Package
1.27 REF
2.39 REF
uP7706
Application Information
4.80 - 5.00
2.29 BSC
1.27 BSC
0.32 - 0.52
Recommended Solder Pad Layout
1.45 - 1.60
0.20 BSC
0.18 - 0.25
0.10 - 0.25
0.41 - 0.89
1.75 MAX
3.81 BSC
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Note
1.Package Outline Unit Description:
BSC: Basic. Represents theoretical exact dimension or dimension target
MIN: Minimum dimension specified.
MAX: Maximum dimension specified.
REF: Reference. Represents dimension for reference use only. This value is not a device specification.
TYP. Typical. Provided as a general value. This value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.
uPI Semiconductor Corp., http://www.upi-semi.com
Rev. F00, File Name: uP7706-DS-F0000
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