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PDF BTA1640I3 Data sheet ( Hoja de datos )

Número de pieza BTA1640I3
Descripción PNP Epitaxial Planar Power Transistor
Fabricantes Cystech Electonics Corp 
Logotipo Cystech Electonics Corp Logotipo



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No Preview Available ! BTA1640I3 Hoja de datos, Descripción, Manual

CYStech Electronics Corp.
wSIspwseuwce.d.DNDaoa.tat:eSC:h62e50e70It734.U0.4c.0o4m
Revised Date :2009.02.04
Page No. : 1/5
PNP Epitaxial Planar Power Transistor
BTA1640I3
BVCEO
IC
RCESAT
-50V
-7A
70mΩ
Features
Low collector-emitter saturation voltage, VCE(sat) = -0.4V(max) @ IC = -3A, IB=-0.15A
Excellent current gain linearity
RoHS compliant package
Symbol
BTA1640I3
Outline
TO-251
BBase
CCollector
EEmitter
BB CC E
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation @ TA=25
Power Dissipation @ TC=25
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Case
Junction Temperature
Storage Temperature
Note : 1. Single Pulse , Pw380μs, Duty2%.
BTA1640I3
Symbol
VCBO
VCEO
VEBO
IC
ICP
PD
PD
RθJA
RθJC
Tj
Tstg
Limits
-60
-50
-5
-7
-10 (Note 1)
1
20
125
6.25
150
-55~+150
Unit
V
V
V
A
W
°C/W
°C/W
°C
°C
CYStek Product Specification

1 page




BTA1640I3 pdf
CYStech Electronics Corp.
TO-251 Dimension
wSIspwseuwce.d.DNDaoa.tat:eSC:h62e50e70It734.U0.4c.0o4m
Revised Date :2009.02.04
Page No. : 5/5
A BC
F
EK
3
2
1
G
I
Marking:
D
A1640
H
J
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0354 0.0591
C 0.0177 0.0236
D 0.0866 0.0945
E 0.2441 0.2677
F 0.2677 0.2835
Millimeters
Min. Max.
0.45 0.55
0.90 1.50
0.45 0.60
2.20 2.40
6.20 6.80
6.80 7.20
DIM
Inches
Min. Max.
G 0.2559
-
H - *0.1811
I - 0.0449
J - 0.0346
K 0.2047 0.2165
*: Typical
Millimeters
Min. Max.
6.50 -
- *4.60
- 1.14
- 0.88
5.20 5.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: KFC; pure tin plated
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTA1640I3
CYStek Product Specification

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