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PDF BTB772AM3 Data sheet ( Hoja de datos )
| Número de pieza | BTB772AM3 | |
| Descripción | Low VCE(sat) PNP Epitaxial Planar Transistor | |
| Fabricantes | Cystech Electonics Corp | |
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CYStech Electronics Corp.
Low VCE(sat) PNP Epitaxial Planar Transistor
BTB772AM3
wSpwewc..DNao.ta: SCh8e1e7Mt43U-.Hcom
Issued Date : 2003.06.17
Revised Date:2005.08.19
Page:1/5
Features
• Low VCE(sat), typically -0.3 V at IC / IB = -2A / -0.2A
• Excellent current gain characteristics
• Complementary to BTD882AM3
Symbol
BTB772AM3
Outline
SOT-89
B：Base
C：Collector
E：Emitter
BCE
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Symbol
VCBO
VCEO
VEBO
IC
ICP
Power Dissipation
Pd
Thermal Resistance, Junction to
Ambient
RθJA
Junction Temperature
Tj
Storage Temperature
Tstg
Note : 1. Single Pulse Pw≦350µs, Duty≦2%.
2. When mounted on a FR-4 PCB with area measuring 10×10×1 mm.
3. When Mounted on a ceramic board with area measuring 40×40×1mm.
BTB772AM3
Limit
-50
-50
-6
-3
-7 (Note 1)
600
1 (Note 2)
2 (Note 3)
208
125 (Note 2)
62.5 (Note 3)
150
-55~+150
Unit
V
V
V
A
A
mW
W
W
°C/W
°C/W
°C/W
°C
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
SOT-89 Dimension
wSpwewc..DNao.ta: SCh8e1e7Mt43U-.Hcom
Issued Date : 2003.06.17
Revised Date:2005.08.19
Page:5/5
A
123
C
Marking:
H AE
B
E
F
G
D
Style: Pin 1. Base 2. Collector 3. Emitter
I
3-Lead SOT-89 Plastic
Surface Mounted Package
CYStek Package Code: M3
DIM
Inches
Min. Max.
A 0.1732 0.1811
B 0.1594 0.1673
C 0.0591 0.0663
D 0.0945 0.1024
E 0.01417 0.0201
Millimeters
Min. Max.
4.40 4.60
4.05 4.25
1.50 1.70
2.40 2.60
0.36 0.51
DIM
Inches
Min. Max.
F 0.0583 0.0598
G 0.1165 0.1197
H 0.0551 0.0630
I 0.0138 0.0161
*: Typical
Millimeters
Min. Max.
1.48 1.527
2.96 3.04
1.40 1.60
0.35 0.41
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy ; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTB772AM3
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTB772AM3.PDF ] | |
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