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PDF BTC5103I3 Data sheet ( Hoja de datos )

Número de pieza BTC5103I3
Descripción High Speed Switching Transistor
Fabricantes Cystech Electonics Corp 
Logotipo Cystech Electonics Corp Logotipo



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No Preview Available ! BTC5103I3 Hoja de datos, Descripción, Manual

CYStech Electronics Corp.
wSIspwseuwce.d.DNDaoa.tat:eSC:h62e50e10It534.U1.0c.0o5m
Revised Date :2009.02.04
Page No. : 1/5
High Speed Switching Transistor
BTC5103I3
Features
Low VCE(sat), VCE(sat)=0.33 V(typical), at IC / IB = 3A / 0.3A
High Switching Speed
Wide SOA
Complementary to BTA1952I3
RoHS compliant package
BVCEO
IC
RCESAT
60V
5A
110mΩ
Symbol
BTC5103I3
Outline
TO-251
BBase
CCollector
EEmitter
B CCE
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Limits
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current (DC)
Collector Current (Pulse)
Power Dissipation (TA=25)
Power Dissipation (TC=25)
VCBO
VCEO
VEBO
IC
ICP
Pd
100
60
6
5
9 *1
1
30 *2
Junction Temperature
Tj 150
Storage Temperature
Tstg -55~+150
Note : *1. Single Pulse Pw=100ms
*2. Printed circuit board, 1.7mm thick, collector copper plating 10mm*10mm or larger
Unit
V
V
V
A
W
°C
°C
BTC5103I3
CYStek Product Specification

1 page




BTC5103I3 pdf
CYStech Electronics Corp.
TO-251 Dimension
wSIspwseuwce.d.DNDaoa.tat:eSC:h62e50e10It534.U1.0c.0o5m
Revised Date :2009.02.04
Page No. : 5/5
A BC
F
EK
3
2
1
G
I
Marking:
D
C5103
H
J
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-251 Plastic Package
CYStek Package Code: I3
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0354 0.0591
C 0.0177 0.0236
D 0.0866 0.0945
E 0.2441 0.2677
F 0.2677 0.2835
Millimeters
Min. Max.
0.45 0.55
0.90 1.50
0.45 0.60
2.20 2.40
6.20 6.80
6.80 7.20
DIM
Inches
Min. Max.
G 0.2559
-
H - *0.1811
I - 0.0449
J - 0.0346
K 0.2047 0.2165
*: Typical
Millimeters
Min. Max.
6.50 -
- *4.60
- 1.14
- 0.88
5.20 5.50
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: KFC; pure tin plated
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTC5103I3
CYStek Product Specification

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