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PDF BTP955J3 Data sheet ( Hoja de datos )
| Número de pieza | BTP955J3 | |
| Descripción | PNP Epitaxial Planar High Current (High Performance) Transistor | |
| Fabricantes | Cystech Electonics | |
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CYStech Electronics Corp.
Spwewc.wN.Do.a:tCa6S0h7eJe3t-4AU.com
Issued Date : 2006.06.07
Revised Date :
Page No. : 1/5
PNP Epitaxial Planar High Current (High Performance) Transistor
BTP955J3
Features
• 4 Amps continuous current, up to 10 Amps peak current
• Very low saturation voltage
• Excellent gain characteristics specified up to 3 Amps
• Ptot=3Watts
• Extremely low equivalent on resistance, RCE(SAT)=90mΩ at 3A
• Pb-free package
Symbol
BTP955J3
Outline
TO-252
B：Base
C：Collector
E：Emitter
Absolute Maximum Ratings (Ta=25°C)
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Collector Current
Base Current
Power Dissipation
@TA=25°C
@TC=25°C
Operating and Storage Temperature Range
Note : 1. Single Pulse , Pw≦380µs,Duty≦2%.
2. When mounted on a PCB with the minimum pad size.
Symbol
VCBO
VCEO
VEBO
IC
ICP
IB
Pd
Tj ; Tstg
BTP955J3
preliminary
BCE
Limits
-120
-100
-6
-4
-10 (Note 1)
-1 (Note 2)
1.75
20
-55 ~ +150
Unit
V
V
V
A
A
A
W
W
°C
CYStek Product Specification
1 page  
CYStech Electronics Corp.
TO-252 Dimension
wSpwewc..DNao.ta: SCh6e0e7Jt43U-A.com
Issued Date : 2006.06.07
Revised Date :
Page No. : 5/5
A
B
L
F
EK
C
D
G
3
H
2
I
1
J
Marking:
P955
Style: Pin 1.Base 2.Collector 3.Emitter
3-Lead TO-252 Plastic Surface Mount Package
CYStek Package Code: J3
DIM
Inches
Min. Max.
A 0.0177 0.0217
B 0.0650 0.0768
C 0.0354 0.0591
D 0.0177 0.0236
E 0.2520 0.2677
F 0.2125 0.2283
Millimeters
Min. Max.
0.45 0.55
1.65 1.95
0.90 1.50
0.45 0.60
6.40 6.80
5.40 5.80
*: Typical
DIM
Inches
Min. Max.
Millimeters
Min. Max.
G 0.0866 0.1102 2.20 2.80
H
- *0.0906 -
*2.30
I
- 0.0354 -
0.90
J
- 0.0315 -
0.80
K 0.2047 0.2165 5.20 5.50
L 0.0551 0.0630 1.40 1.60
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTP955J3
preliminary
CYStek Product Specification
5 Page | ||
| Páginas | Total 5 Páginas | |
| PDF Descargar | [ Datasheet BTP955J3.PDF ] | |
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