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PDF ESDA18-1F2 Data sheet ( Hoja de datos )
| Número de pieza | ESDA18-1F2 | |
| Descripción | Transil - transient voltage suppressor | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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ESDA18-1F2
Transil™, transient voltage suppressor
Features
■ Stand-off voltage 16V
■ Unidirectional device
■ Low clamping factor VCL/VBR
■ Fast response time
■ Very thin package: 0.65 mm
Complies with the following standards
■ IEC 61000-4-2 Level 4
– 15 kV (air discharge)
– 8 kV (contact discharge)
Description
The ESDA18-1F2 is a single line Transil diode
designed specifically for the protection of
integrated circuits into portable equipment and
miniaturized electronics devices subject to ESD
and EOS transient overvoltages.
Flip Chip
(4 bumps)
Figure 1. Pin configuration (bump side)
AB
1
KA
2
KA
KA
April 2008
TM: Transil is a trademark of STMicroelectronics.
Rev 2
1/8
www.st.com
8
1 page  
ESDA18-1F2
3 Ordering information scheme
Ordering infworwmwa.DtiaotanSshecehte4Um.ceom
Figure 10. Ordering information scheme
ESDA 18 - 1 Fx
ESD Array
Breakdown Voltage
18 = 18 Volts max.
Number of line
1 = signle line
Package
F = Flip Chip
x = 2: Lead-free, pitch = 500 µm, bump = 315 µm
4 Packing information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Figure 11. Flip Chip package dimensions
500 µm ± 50
315 µm ± 50
650 µm ± 65
225 µm
0.92 mm ± 30 µm
5/8
5 Page | ||
| Páginas | Total 8 Páginas | |
| PDF Descargar | [ Datasheet ESDA18-1F2.PDF ] | |
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