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PDF ESDALC6V1F2 Data sheet ( Hoja de datos )
| Número de pieza | ESDALC6V1F2 | |
| Descripción | Quad low capacitance Transil array | |
| Fabricantes | STMicroelectronics | |
| Logotipo |  |
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ESDALC6V1F2
Quad low capacitance Transil™ array for ESD protection
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
■ Computers
■ Printers
www.Data■SheCeot4mU.mcoumnication systems and cellular phones
■ Video equipment
This device is particularly adapted to the
protection of symmetrical signals
Features
■ 4 unidirectional Transil functions.
■ Breakdown voltage VBR = 6.1 V min.
– Low diode capacitance (12 pF @ 0 V)
– Low leakage current (< 500 nA @ 3 V)
– very small PCB area (1.25 mm2)
■ Lead free package
Benefits
■ High ESD protection level
■ High integration
■ Suitable for high density boards
Description
The ESDALC6V1F2 is a monolithic array
designed to protect up to 4 lines againast ESD
transients. The device is ideal for applications
where both reduced line capacitance and board
space saving are required.
TM: Transil is a trademark of STMicroelectronics
Lead free Flip-Chip
(5 bumps)
Figure 1. Functional diagram
A1 A3 C1 C3
B2
AB C
1
2
3
Table 1. Order code
Part number
ESDALC6V1F2
Marking
ED
Complies with the following standards:
IEC 61000-4-2 15 kV (air discharge)
8 kV (contact discharge)
MIL STD 883E - Method 3015-7: class 3
25 kV (Human body model)
July 2007
Rev 2
1/7
www.st.com
1 page  
ESDALC6V1F2
3 Package information
Figure 8. Flip-Chip dimensions
500 µm ± 10
250 µm ± 10
315 µm ± 50
Package information
650 µm ± 50
www.DataSheet4U.com
0.95 mm ± 50 µm
Figure 9. Flip-Chip footprint
Copper pad Diameter :
250µm recommended , 300µm max
Solder stencil opening : 330µm
Solder mask opening recommendation :
340µm min for 315µm copper pad diameter
Figure 10. Marking
Dot, ST logo
xx = marking
z = manufacturing location
yww = datecode
(y = year ww = week)
E
xxz
y ww
5/7
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet ESDALC6V1F2.PDF ] | |
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