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PDF KNW013-020 Data sheet ( Hoja de datos )
| Número de pieza | KNW013-020 | |
| Descripción | Power Modules | |
| Fabricantes | Lineage Power Corporation | |
| Logotipo |  |
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Data Sheet
November 2, 2010
KNW013-020 (Sixteenth-Brick) Power Modules:
36 –75Vdc Input; 3.3Vdc to 5.0Vdc Output; 13A to 20A Output Current
RoHS Compliant
Applications
Distributed power architectures
Wireless networks
Access and optical networking equipment
including Power over Ethernet (PoE)
Enterprise networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Options
Negative Remote On/Off logic
Surface Mount (Tape and Reel, -SR Suffix)
Over current/Over temperature/Over voltage
protections (auto-restart)
Shorter lead trim
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to RoHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Delivers up to 20A output current
5V(13A), 3.3V(20A)
High efficiency – 91% at 3.3V full load
Small size and low profile:
33.0 mm x 22.9 mm x 10.2 mm
(1.30 in x 0.9 in x 0.40 in)
Industry standard DOSA footprint
-20% to +10% output voltage adjustment trim
Remote on/off
Remote sense
No reverse current during output shutdown
Over temperature protection (latching)
Output overcurrent/overvoltage protection
(latching)
Wide operating temperature range (-40°C to 85°C)
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
Meets the voltage isolation requirements for
ETSI 300-132-2 and complies with and is licensed
for Basic Insulation rating per EN60950-1
UL*Recognized to UL60950-1, CAN/CSA† C22.2
No.60950-1, and EN60950-1(VDE ‡ 0805-1)
Licensed
CE mark meets 2006/95/EC directive§
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Description
The KNW (Sixteenth-brick) series power modules are isolated dc-dc converters that operate over a wide input
voltage range of 36 to 75Vdc and provide a single precisely regulated output. The output is fully isolated from the
input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency,
typical efficiency of 91% for 3.3V/20A. These open frame modules are available either in surface-mount (-SR) or in
through-hole (TH) form.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
Document No: DS08-009 ver. 1.04
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
PDF name: knw013-020_ds.pdf
§ This product is intended for integration into end-use equipment. All of the required procedures of end-use equipment should be followed.
** ISO is a registered trademark of the International Organization of Standards
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1 page  
Data Sheet
November 2, 2010
KNW013-020 Series Power Modules:
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current
Characteristic Curves
The following figures provide typical characteristics for the KNW013A0A (5V, 13A) at 25oC. The figures are identical
for either positive or negative remote On/Off logic.
95
90
85
80
75
70
0
Vin=75V
Vin=48V
Vin=36V
3 6 9 12
OUTPUT CURRENT, IO (A)
15
14
12
10
8
6
4
2
0
20
NC
0.5 m/s
100 LFM
1.0 m/s
200 LFM
2.0 m/s
400 LFM
30 40 50 60 70 80
AMBIENT TEMPERATURE, TA OC
90
Figure 1. Converter Efficiency versus Output Current. Figure 4. Derating Output Current versus Local
Ambient Temperature and Airflow.
TIME, t (1s/div)
TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (VIN = VIN,NOM,
Io = Io,max).
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io =
Io,max).
TIME, t (200 s /div)
TIME, t (5ms/div)
Figure 3. Transient Response to Dynamic Load
Figure 6. Typical Start-up Using Input Voltage (VIN =
Change, 0.1A/µS, from 75% to 50% to 75% of full load. VIN,NOM, Io = Io,max).
LINEAGE POWER
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5 Page 
Data Sheet
November 2, 2010
KNW013-020 Series Power Modules:
36 – 75Vdc Input; 3.3 to 5.0Vdc Output; 13 to 20A Output Current
Surface Mount Information
Pick and Place
The KNW013-020 modules use an open frame
construction and are designed for a fully automated
assembly process. The pick and place locations on
the module are the larger magnetic core or the
transistor package as shown in Figure 22. The
modules are fitted with a label which meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 22. Pick and Place Locations.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The recommended nozzle diameter for reliable
operation is 5mm. Oblong or oval nozzles up to 11 x 5
mm may also be used within the space available.
Tin Lead Soldering
The KNW013-020 power modules (both non-Z and –Z
codes) can be soldered either in a conventional
Tin/Lead (Sn/Pb) process. The non-Z version of the
KNW013-020 modules are RoHS compliant with the
lead exception. Lead based solder paste is used in
the soldering process during the manufacturing of
these modules. These modules can only be soldered
in conventional Tin/lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
300
P eak Temp 235oC
250
Co o ling
Heat zo ne
200 max 4oCs-1
zo ne
1-4oCs-1
150
100
So ak zo ne
30-240s
Tlim above
205oC
50 P reheat zo ne
max 4oCs-1
0
REFLOW TIME (S)
Figure 23. Reflow Profile for Tin/Lead (Sn/Pb)
process
240
235
230
225
220
215
210
205
200
0 10 20 30 40 50
Figure 24. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
60
LINEAGE POWER
11
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