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PDF FSBB30CH60C Data sheet ( Hoja de datos )

Número de pieza FSBB30CH60C
Descripción Smart Power Module
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FSBB30CH60C Hoja de datos, Descripción, Manual

FSBB30CH60C
Smart Power Module
February 2008
Motion-SPMTM
Features
• UL Certified No.E209204(SPM27-EC package)
• Very low thermal resistance due to using DBC
• Easy PCB layout due to built in bootstrap diode
• 600V-30A 3-phase IGBT inverter bridge including control ICs
for gate driving and protection
• Divided negative dc-link terminals for inverter current sensing
applications
• Single-grounded power supply due to built-in HVIC
• Isolation rating of 2500Vrms/min.
Applications
• AC 100V ~ 253V three-phase inverter drive for small power
ac motor drives
• Home appliances applications like air conditioner and wash-
ing machine
General Description
It is an advanced motion-smart power module (Motion-SPMTM)
that Fairchild has newly developed and designed to provide
very compact and high performance ac motor drives mainly tar-
geting low-power inverter-driven application like air conditioner
and washing machine. It combines optimized circuit protection
and drive matched to low-loss IGBTs. System reliability is fur-
ther enhanced by the integrated under-voltage lock-out and
short-circuit protection. The high speed built-in HVIC provides
opto-coupler-less single-supply IGBT gate driving capability that
further reduce the overall size of the inverter system design.
Each phase current of inverter can be monitored separately due
to the divided negative dc terminals.
Top View
44mm
Bottom View
26.8mm
Figure 1.
©2008 Fairchild Semiconductor Corporation
FSBB30CH60C Rev. D
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FSBB30CH60C pdf
Absolute Maximum Ratings (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Symbol
Parameter
Conditions
Rating
VPN
VPN(Surge)
VCES
± IC
± ICP
PC
TJ
Supply Voltage
Supply Voltage (Surge)
Collector-emitter Voltage
Each IGBT Collector Current
Each IGBT Collector Current (Peak)
Collector Dissipation
Operating Junction Temperature
Applied between P- NU, NV, NW
Applied between P- NU, NV, NW
TC = 25°C
TC = 25°C, Under 1ms Pulse Width
TC = 25°C per One Chip
(Note 1)
Note:
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150°C(@TC 125°C).
450
500
600
30
60
106
-40 ~ 150
Control Part
Symbol
Parameter
VCC Control Supply Voltage
VBS High-side Control Bias
Voltage
VIN Input Signal Voltage
VFO Fault Output Supply Voltage
IFO Fault Output Current
VSC Current Sensing Input Voltage
Conditions
Rating
Applied between VCC(H), VCC(L) - COM
20
Applied between VB(U) - VS(U), VB(V) - VS(V),
VB(W) - VS(W)
20
Applied between IN(UH), IN(VH), IN(WH),
IN(UL), IN(VL), IN(WL) - COM
-0.3~17
Applied between VFO - COM
-0.3~VCC+0.3
Sink Current at VFO Pin
5
Applied between CSC - COM
-0.3~VCC+0.3
Units
V
V
V
A
A
W
°C
Units
V
V
V
V
mA
V
Bootstrap Diode Part
Symbol
Parameter
VRRM
IF
IFP
TJ
Maximum Repetitive Reverse Voltage
Forward Current
Forward Current (Peak)
Operating Junction Temperature
Conditions
TC = 25°C
TC = 25°C, Under 1ms Pulse Width
Rating
600
0.5
2
-40 ~ 150
Units
V
A
A
°C
Total System
Symbol
Parameter
VPN(PROT) Self Protection Supply Voltage Limit
(Short Circuit Protection Capability)
TC
TSTG
VISO
Module Case Operation Temperature
Storage Temperature
Isolation Voltage
Conditions
VCC = VBS = 13.5 ~ 16.5V
TJ = 150°C, Non-repetitive, less than 2μs
-40°CTJ 150°C, See Figure 2
60Hz, Sinusoidal, AC 1 minute, Connection
Pins to heat sink plate
Rating
400
-40 ~ 125
-40 ~ 150
2500
Units
V
°C
°C
Vrms
Thermal Resistance
Symbol
Parameter
Conditions
Rth(j-c)Q
Rth(j-c)F
Junction to Case Thermal
Resistance
Inverter IGBT part (per 1/6 module)
Inverter FWD part (per 1/6 module)
Note:
2. For the measurement point of case temperature(TC), please refer to Figure 2.
Min.
-
-
Typ.
-
-
Max.
1.17
1.87
Units
°C/W
°C/W
FSBB30CH60C Rev. D
5
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FSBB30CH60C arduino
Lower arms
control input
Protection
circuit state
Internal IGBT
Gate-Emitter Voltage
c6 c7
SET
RESET
c4
c3
c2
SC
Output Current
c1
c8
Sensing Voltage
of the shunt
resistance
Fault Output Signal
SC Reference Voltage
CR circuit time
c5 constant delay
(with the external shunt resistance and CR connection)
c1 : Normal operation: IGBT ON and carrying current.
c2 : Short circuit current detection (SC trigger).
c3 : Hard IGBT gate interrupt.
c4 : IGBT turns OFF.
c5 : Fault output timer operation starts: The pulse width of the fault output signal is set by the external capacitor CFO.
c6 : Input “L” : IGBT OFF state.
c7 : Input “H”: IGBT ON state, but during the active period of fault output the IGBT doesn’t turn ON.
c8 : IGBT OFF state
Figure 10. Short-Circuit Current Protection (Low-side Operation only)
FSBB30CH60C Rev. D
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