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Weitron Technology - Surface Mount Switching Multi-Chip Diode Array

Numéro de référence WIMN10
Description Surface Mount Switching Multi-Chip Diode Array
Fabricant Weitron Technology 
Logo Weitron Technology 





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WIMN10 fiche technique
Surface Mount Switching Multi-Chip
Diode Array
P b Lead(Pb)-Free
Features:
* Ultra High Speed Switching
* Ultra-Small Surface Mount Package
* For General Purpose Switching Applications
* High Conductance Power Dissipation
Mechanical Data:
* Case : TSOP-6
* Case Material : Molded Plastic. UL Flammability
Classification Ration 94V-0
* Moisture Sensitivity : Level 1 per J-STD-020C
* Terminals : Solderable per MIL-STD-202, Method 208
* Polarity : See Diagram
WIMN10
MULTI-CHIP DIODES
100m AMPERES
80 VOLTS
6
1
TSOP-6
TSOP-6 Outline Dimensions
A
6 54
1 23
BC
D
H
www.DataSheet4U.com
K
J
Ө
L
M
Unit:mm
TSOP-6
Dim Min
A 0.25
B 1.30
C 2.50
D 0.85
Ө
H 2.90
J 0.01
K 0.90
L 0.20
M 0.10
Max
0.50
1.70
3.00
1.05
10°
3.10
0.10
1.10
0.60
0.26
WEITRON
http://www.weitron.com.tw
1/3
04-Mar-09

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