FSBB15CH60F Datasheet PDF - Fairchild Semiconductor
| Part Number | FSBB15CH60F | |
| Description | Smart Power Module | |
| Manufacturers | Fairchild Semiconductor | |
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There is a preview and FSBB15CH60F download ( pdf file ) link at the bottom of this page. Total 16 Pages | ||
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FSBB15CH60F
Smart Power Module
April 28, 2006
SPM TM
Features
• UL Certified No.E209204 (SPM27-CA package)
• Very low thermal resistance due to using DBC
• 600V-15A 3-phase IGBT inverter bridge including control ICs
for gate driving and protection
• Divided negative dc-link terminals for inverter current sensing
applications
• Single-grounded power supply due to built-in HVIC
• Isolation rating of 2500Vrms/min.
Applications
• AC 100V ~ 253V three-phase inverter drive for small power
ac motor drives
• Home appliances applications like air conditioner and
washing machine.
General Description
It is an advanced smart power module (SPMTM) that Fairchild
has newly developed and designed to provide very compact
and high performance ac motor drives mainly targeting low-
power inverter-driven application like air conditioner and wash-
ing machine. It combines optimized circuit protection and drive
matched to low-loss IGBTs. System reliability is further
enhanced by the integrated under-voltage lock-out and short-
circuit protection. The high speed built-in HVIC provides opto-
coupler-less single-supply IGBT gate driving capability that fur-
ther reduce the overall size of the inverter system design. Each
phase current of inverter can be monitored separately due to
the divided negative dc terminals.
Top View
44mm
Bottom View
26.8mm
www.DataSheet4U.net
Figure 1.
©2006 Fairchild Semiconductor Corporation
FSBB15CH60F Rev. D
1
www.fairchildsemi.com
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Absolute Maximum Ratings (TJ = 25°C, Unless Otherwise Specified)
Inverter Part
Symbol
Parameter
Conditions
Rating Units
VPN
VPN(Surge)
VCES
± IC
± ICP
PC
TJ
Supply Voltage
Supply Voltage (Surge)
Collector-emitter Voltage
Each IGBT Collector Current
Each IGBT Collector Current (Peak)
Collector Dissipation
Operating Junction Temperature
Applied between P- NU, NV, NW
Applied between P- NU, NV, NW
TC = 25°C
TC = 25°C, Under 1ms Pulse Width
TC = 25°C per One Chip
(Note 1)
450
500
600
15
30
50
-20 ~ 125
V
V
V
A
A
W
°C
Note:
1. The maximum junction temperature rating of the power chips integrated within the SPM is 150 °C(@TC ≤ 100°C). However, to insure safe operation of the SPM, the average
junction temperature should be limited to TJ(ave) ≤ 125°C (@TC ≤ 100°C)
Control Part
Symbol
Parameter
Conditions
Rating
VCC Control Supply Voltage
Applied between VCC(UH), VCC(VH), VCC(WH), VCC(L) -
COM
20
VBS High-side Control Bias
Voltage
Applied between VB(U) - VS(U), VB(V) - VS(V), VB(W) -
VS(W)
20
VIN Input Signal Voltage
Applied between IN(UH), IN(VH), IN(WH), IN(UL), IN(VL),
IN(WL) - COM
-0.3~17
VFO Fault Output Supply Voltage Applied between VFO - COM
-0.3~VCC+0.3
IFO Fault Output Current
Sink Current at VFO Pin
5
VSC Current Sensing Input Voltage Applied between CSC - COM
-0.3~VCC+0.3
Units
V
V
V
V
mA
V
Total System
Symbol
Parameter
VPN(PROT) Self Protection Supply Voltage Limit
(Short Circuit Protection Capability)
TC
TSTG
VISO
Module Case Operation Temperature
Storage Temperature
Isolation Voltage
Conditions
VCC = VBS = 13.5 ~ 16.5V
TJ = 125°C, Non-repetitive, less than 2µs
-20°C ≤ TJ ≤ 125°C, See Figure 2
60Hz, Sinusoidal, AC 1 minute, Connection
Pins to DBC substrate
Rating
400
-20 ~ 100
-40 ~ 125
2500
Units
V
°C
°C
Vrms
www.DataSheet4U.net
Thermal Resistance
Symbol
Parameter
Conditions
Rth(j-c)Q
Rth(j-c)F
Junction to Case Thermal Inverter IGBT part (per 1/6 module)
Resistance
Inverter FWD part (per 1/6 module)
Note:
2. For the measurement point of case temperature(TC), please refer to Figure 2.
Min.
-
-
Typ.
-
-
Max.
2.02
3.15
Units
°C/W
°C/W
Package Marking and Ordering Information
Device Marking
FSBB15CH60F
Device
FSBB15CH60F
Package
SPM27CA
Reel Size
-
Tape Width
-
Quantity
10
FSBB15CH60F Rev. D
5
www.fairchildsemi.com
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| Information | Total 16 Pages | |
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