|
|
PDF ZICM357SP2-x-HT Data sheet ( Hoja de datos )
| Número de pieza | ZICM357SP2-x-HT | |
| Descripción | Transceiver Based Modules | |
| Fabricantes | CEL | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de ZICM357SP2-x-HT (archivo pdf) en la parte inferior de esta página. Total 17 Páginas | ||
|
No Preview Available !
PRELIMINARY DATASHEET
MeshConnect™ EM357 High Temp Mini Modules
ZICM357SP2-x-HT
EmberTM EM357 Transceiver Based Modules
Integrated Transceiver Modules for ZigBee/IEEE 802.15.4
DESCRIPTION
The MeshConnect™ EM357 High Temperature
(High Temp) Mini Modules from California Eastern
Laboratories (CEL) combine high performance RF
solutions with the market's premier ZigBee® stack.
Available in a high output power option (+20 dBm),
these modules can accommodate variable range
and performance requirements. The tiny module
footprint makes them suitable for a wide range of
ZigBee applications. The MeshConnect EM357
High Temp Mini Modules are certified and qualified,
enabling customers to accelerate time to market by
greatly reducing the design and certification phases
of development.
CEL's MeshConnect EM357 High Temp Mini Modules
(ZICM357SP2-1-HT and ZICM357SP2-1C-HT) are
based on the Ember EM357 Zigbee compliant SoC
radio IC. The IC is a single-chip solution, compliant with
ZigBee specifications and IEEE 802.15.4, a complete
wireless solution for all ZigBee applications. The IC
consists of an RF transceiver with the baseband
modem, a hardwired MAC and an embedded 32-
bit ARM ® Cortex™-M3 microcontroller with internal
RAM (12 kB) and Flash (192 kB) memory. The device
provides numerous general-purpose I/O pins and
peripheral functions such as timers and UARTs.
CEL's MeshConnect EM357 High Temp Mini Modules
are suitable for applications such as solar and lighting
controls where the temperature requirements may
exceed the industrial range specs. The modules
are designed and built using high temperature
components to provide a robust solution without
compromising performance.
MeshConnect™ EM357 High Temp Mini Modules
Operating Temperature: -40 ºC to 110 ºC
• 192 kB FLASH
• 12 kB SRAM
• 32-bit ARM® Cortex™-M3
• Up to 23 GPIO Pins
• SPI (Master/Slave), TWI, UART
• Timers, Serial Wire/JTAG Interface
• 5-channel 14-bit ADC
ZICM357SP2-x-HT
Tx: +20 dBm
Rx: -103 dBm
Link Budget: +123 dB
IC
FEATURES
••High RF Performance:
••Mini Footprint:
Up to 123 dB RF Link Budget
RX Sensitivity:
-103 dBm
••Data Rate: 250 kbps
- 0.940" x 0.655"
(23.9 mm x 16.6mm)
••Antenna Options
1) Integrated PCB Trace Antenna
••Advanced Cortex-M3 Processor or
••Advanced Power Management 2) RF Port for External Antenna
••16 RF Channels
••Supports Mesh Networks
••Industry's Premier ZigBee Pro ••AES Encryption
Stack: EmberZNet PRO™
••FCC and IC Certifications
••ROHS Compliant
APPLICATIONS
••Smart Energy /Grid Markets
- Thermostats
- In-Home Displays
- Smart Plugs
••Home Automation and Control
- Energy Management
- Security Devices
- HVAC Control
••Building Automation
and Control
••Commercial and Residential
Lighting
- Fixtures and Control
••Solar Inverters and Control
••General ZigBee Wireless
Sensor Networking
This document is subject to change without notice
Document No: 0011-00-07-02-000 (Issue A)
Date Published: October 9, 2013
Page 1
Free Datasheet http://www.datasheet4u.com/
1 page  
EM357 High Temp Mini Modules
HIGH TEMPERATURE OUTPUT POWER
FCC restrictions require the output power to be maintained
below 21 dBm which corresponds to Power Setting -2 at
25 ºC. For those applications requiring the maximum output
power at 110 ºC, the power setting can be increased up to
Power Setting 6 when operated at elevated temperatures.
One method of implementation would be to create a look-
up table for Power Setting versus temperature which the
firmware would use to control the output power. This
would require the host board to implement a temperature
sensing circuit and the ability of the module to have access
to the temperature such as using a temperature sensing IC
connected to one of the module analog inputs.
System / Host Board
Operating Temperature
-40º C to 110 º C
EM357 High Temp Mini Module
ZICM357SP2-x-HT
EM357 IC
Micro ADC
Radio
Temp
Sensor
SOFTWARE / FIRMWARE
CEL's MeshConnect EM357 High Temp Mini Modules are ideal platforms for EmberZNet PRO™, the industry’s
most deployed and field proven ZigBee compliant stack supporting the ZigBee PRO feature Set. EmberZNet
PRO is a complete ZigBee protocol software package containing all the elements required for mesh networking
applications. For more information regarding the software development for this IC, visit www.silabs.com.
CEL provides reference software that runs multiple functions and executes various commands. The firmware
allows the execution of IEEE 802.15.4 communication, validation and manufacturing tests. For example,
users can setup a simple ZigBee Point-to-Point network to perform Range and Packet Error Rate (PER) tests.
The software can also place the module in various operating modes, which allows for setting and/or testing
various parameters.
The ZICM357SP2-x-HT uses the transceiver's Alternate RF ports for transmitting and should use Power Mode 2.
This document is subject to change without notice
Document No: 0011-00-07-02-000 (Issue A)
Page 5
Free Datasheet http://www.datasheet4u.com/
5 Page 
EM357 High Temp Mini Modules
PROCESSING
Recommended Reflow Profile
Parameter Values
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TLiquidus
Tpeak
Time within 5º of Tpeak
Time from 25º to Tpeak
Ramp down rate
3º/sec max
150ºC
200ºC
60-120 sec
217ºC
60-150 sec
250ºC
20-30 sec
8 min max
6ºC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC
Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily
removed with any cleaning process.
• Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
• Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
• Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a
single wave soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
This document is subject to change without notice
Document No: 0011-00-07-02-000 (Issue A)
Page 11
Free Datasheet http://www.datasheet4u.com/
11 Page | ||
| Páginas | Total 17 Páginas | |
| PDF Descargar | [ Datasheet ZICM357SP2-x-HT.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| ZICM357SP2-x-HT | Transceiver Based Modules | CEL |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |