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RX-8571LC fiches techniques PDF

EPSON Electronics - REAL TIME CLOCK MODULE

Numéro de référence RX-8571LC
Description REAL TIME CLOCK MODULE
Fabricant EPSON Electronics 
Logo EPSON Electronics 





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RX-8571LC fiche technique
Real time clock module
REAL TIME CLOCK MODULE (I2C-Bus)
Low current consumption
RX - 8571SA/NB/LC
Built-in frequency adjusted 32.768kHz crystal unit.
Interface Type
: I2C-Bus Interface(400kHz)
Operating voltage range
: 1.6V to5.5V
Wide Timekeeper voltage range : 1.3Vto5.5V
Low backup current
: 220nA/3V(Typ.)
32.768 kHz frequency output function : C-MOS output With Control Pin
User RAM
: 128 bit
The various functions include full calendar, alarm, timer,etc.
(Long-running timer : 65535 hours)
* The I2C-Bus is a trademark of NXP Semiconductors
Actual size
RX-8571SA
Product Number (Please contact us)
RX-8571SA : X1B000072xxxx00
RX-8571NB : X1B000062xxxx00
RX-8571LC : X1B000052xxxx00
RX-8571NB
RX-8571LC
Block diagram
Overview
FOE
FOUT
/ IRQ
( 32.768 kHz )
XD XG
OSC
DIVIDER
FOUT
CONTROLLER
INTERRUPTS
CONTROLLER
CLOCK
and
CALENDAR
TIMER REGISTER
ALARM REGISTER
/BM
DAS
SDA
SCL
INTERFACE
CIRCUIT
CONTROL
REGISTER
and
SYSTEM
CONTROLLER
USER REGISTER
128 bit (16 word x 8 bit)
32.768 kHz frequency output function
FOE pin enable output on/off control.
Output frequency can be selected
as 32.768 kHz, 1024 Hz, 1 Hz.
Timer Function
Timer function can be set up between
1/4096 second and 65535 hours.
Timing period are 1 h, 1 min, 64 Hz, 4096 Hz.
It is recorded automatically to TF-bit at the time of
event occurs, and possible to output with /IRQ pin
output.
Alarm function
Alarm function can be set to day of week,
day, hour, or minute.
It is recorded automatically to AF-bit at the time of
event occurs, and possible to output with /IRQ pin
output.
 Built-in RAM
128 bit (16 word x 8 bit)
Terminal connection/External dimensions
(Unit:mm)
RX8571SA
RX8571NB
RX8571LC
1. GND
2. N.C.
3. DAS
4. SCL
5. SDA
6. /BM
14. FOUT
13. N.C.
12. N.C.
11. N.C.
5.0
10. /IRQ
9. N.C.
1. FOE
2. /BM
3. (GND)
4. SDA
5. SCL
6. DAS
7. GND
8. N.C.
9. FOUT
22. N.C.
21. N.C.
20. N.C.
19. N.C.
18. N.C.
17. N.C.
4.8 16. N.C.
15. N.C.
1.30.1
14. N.C.
1. FOE
2. /BM
3. SDA
4. SCL
5. DAS
12. VDD
11. N.C.
10. N.C.
2.4 9. N.C.
8. /IRQ
7. FOE
7.40.2
SOP - 14 pin
8. VDD
10. /IRQ
11. VDD
5.00.2
SON22 pin
13. 
12. 
6. GND
2.8
VSOJ12pin
7. FOUT
The metal case inside of the molding compound may be exposed on the top or bottom of this product. This purely cosmetic and does not have any effect on quality, reliability or electrical specs.
*Stop using the glue
Any glue must never use it after soldering LC-package to a circuit board.This product has glass on the back side of a package.When glue invasions between circuit board side
and glass side, then glass cracks by thermal expansion of glue.In this case a crystal oscillation stops.Consider glue abolition or glue do not touch to LC-package
Specifications (characteristics)
 Refer to application manual for details.
Recommended Operating Conditions
Item
Symbol Conditions
Min. Typ. Max.
Power voltage
VDD
- 1.6 3.0 5.5
Clock voltage
VCLK
-
1.3 3.0 5.5
Operating
temperature
TOPR
-
-40 +25 +85
Frequency characteristics
Item Symbol
Conditions
Rating
Frequency
tolerance
Oscillation
start up time
f/f
tSTA
Ta=+25C
VDD=3.0V
Ta=+25C
VDD=1.6V
B: 523
1 Max.
Please ask for tighter tolerance.( Equivalent to 1 minute of monthly deviation )
Unit
V
V
C
Unit
106
s
Current consumption characteristics
Item Symbol
Conditions
Min. Typ. Max. Unit
FOE=/BM=L
FOUT=OFF
LC
type
- 220 400
/IRQ=OFF
nA
VDD =3.0V
Ta= +25C
SA/NB
type
-
200 400
Current
Consumption
IDD
FOE=/BM=L
FOUT=OFF
/IRQ=OFF
- - - 550 nA
VDD =3.0V
Ta= -40Cto+85C

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