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PDF MN130S Data sheet ( Hoja de datos )

Número de pieza MN130S
Descripción silicon power transistor
Fabricantes Sanken 
Logotipo Sanken Logotipo



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No Preview Available ! MN130S Hoja de datos, Descripción, Manual

1.
Scope
MN130S
The present specifications shall apply to Sanken silicon power transistor type MN130S.
2. ( 25 )
Absolute Maximum Ratings (Ta=25 )
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current
Base Current
Collector Power Dissipation
Junction Temperature
Storage Temperature
Symbol
VCBO
VCEO
VEBO
IC
IB
PC
Tj
Tstg
Rating
200
140
6
10
4
130 (Tc=25 )
150
-55 150
Unit
V
V
V
A
A
W
3. ( 25 )
Electrical Characteristics (Ta=25 )
Characteristic
Collector Cut-off Current
Emitter Cut-off Current
Collector-Emitter Voltage
DC Current Transfer Ratio
Collector-Emitter Saturation Voltage
Cut-off Frequency
Output Capacitance
Symbol Test Conditions
ICBO VCB=200V
IEBO VEB=6V
VCEO IC=50mA
hFE VCE=4V, IC=3A
VCE (sat) IC=5A, IB=0.5A
fT VCE=12V, IE=-0.5A
Cob
VCB=10V, IE=0A
f=1MHz
hFE : 70 140 (P), 90 180 (Y)
hFE rank
Limits
MIN TYP MAX Unit
10 A
10 A
140 V
70 180
0.5 V
20 MHz
250 pF
050812
SSE-23638
16
61426-01

1 page




MN130S pdf
(4)
Mounting Method of Heatsink
Torque when Tightening Screws Mounting
Table 1
Thermal resistance increases when tightening torque is small, and radiation effects are decreased. When
the torque is too high, the screw can cut, the heatsink can be deformed, and / or distortion can arise in the
product’s frame. To avoid these problems, Table 1 show the recommended tightening torques for each
product type.
Table 1. Screw Tightening Torques
Package
MT25 FM20 (TO-220 & Full Mold )
MT100 FM100 (TO-3P & Full Mold )
MT200 (TO-3P Wide 2Screw Type)
2GR 5Pin SIP
SLA
Screw Tightening Torques
0.490 to 0.686 N m (5 to 7 kgf cm)
0.686 to 0.882 N m (7 to 9 kgf cm)
0.686 to 0.882 N m (7 to 9 kgf cm)
0.686 to 0.882 N m (7 to 9 kgf cm)
0.588 to 0.784 N m (6 to 8 kgf cm)
4mm
Diameter of hole of heatsink: Less than 4mm
As the slack of press mold for making the hole will be the cause of resin crack at the mounting,
please pay special attention for that.
(5)
Soldering Temperature
Recommended soldering conditions (Maximum
260 10sec.
350 3sec. (
)
Solder iron
1.5mm
(at a distance of 1.5 mm from the main body of Power Transistors)
050812
SSE-23638
56
61426-01

5 Page










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