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MT29F64G08AECAB fiches techniques PDF

Micron - NAND Flash Memory

Numéro de référence MT29F64G08AECAB
Description NAND Flash Memory
Fabricant Micron 
Logo Micron 





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MT29F64G08AECAB fiche technique
Micron Confidential and Proprietary
32Gb, 64Gb, 128Gb, 256Gb Asynchronous/Synchronous NAND
Features
NAND Flash Memory
MT29F32G08ABAAA, MT29F64G08AFAAA, MT29F128G08A[J/K/M]AAA
MT29F256G08AUAAA, MT29F32G08ABCAB, MT29F64G08AECAB
MT29F128G08A[K/M]CAB, MT29F256G08AUCAB
Features
• Open NAND Flash Interface (ONFI) 2.2-compliant1
• Single-level cell (SLC) technology
• Organization
– Page size x8: 8640 bytes (8192 + 448 bytes)
– Block size: 128 pages (1024K + 56K bytes)
– Plane size: 2 planes x 2048 blocks per plane
– Device size: 32Gb: 4096 blocks;
64Gb: 8192 blocks;
128Gb: 16,384 blocks;
256Gb: 32,786 blocks
• Synchronous I/O performance
– Up to synchronous timing mode 5
– Clock rate: 10ns (DDR)
– Read/write throughput per pin: 200 MT/s
• Asynchronous I/O performance
– Up to asynchronous timing mode 5
tRC/tWC: 20ns (MIN)
– Read/write throughput per pin: 50 MT/s
• Array performance
– Read page: 35µs (MAX)
– Program page: 350µs (TYP)
– Erase block: 1.5ms (TYP)
• Operating Voltage Range
– VCC: 2.7–3.6V
– VCCQ: 1.7–1.95V, 2.7–3.6V
• Command set: ONFI NAND Flash Protocol
• Advanced Command Set
– Program cache
– Read cache sequential
– Read cache random
– One-time programmable (OTP) mode
– Multi-plane commands
– Multi-LUN operations
– Read unique ID
– Copyback
• First block (block address 00h) is valid when ship-
ped from factory. For minimum required ECC, see
Error Management (page 114).
• RESET (FFh) required as first command after pow-
er-on
• Operation status byte provides software method for
detecting
– Operation completion
– Pass/fail condition
– Write-protect status
• Data strobe (DQS) signals provide a hardware meth-
od for synchronizing data DQ in the synchronous
interface
• Copyback operations supported within the plane
from which data is read
• Quality and reliability
– Data retention: JESD47G compliant; see qualifi-
cation report
– Endurance: 60,000 PROGRAM/ERASE cycles
• Operating temperature:
– Commercial: 0°C to +70°C
– Industrial (IT): –40ºC to +85ºC
• Package
– 52-pad LGA
– 48-pin TSOP
– 100-ball BGA
– 132-ball BGA
Note: 1. The ONFI 2.2 specification is available at
www.onfi.org.
PDF: 09005aef83e0bed4
M73A_32Gb_64Gb_128Gb_256Gb_AsyncSync_NAND.pdf Rev. F 5/12 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

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