ADM7160 Datasheet PDF - Analog Devices
| Part Number | ADM7160 | |
| Description | 200 mA Linear Regulator | |
| Manufacturers | Analog Devices | |
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Data Sheet
FEATURES
PSRR performance of 54 dB at 100 kHz
Ultralow noise independent of VOUT
3 µV rms, 0.1 Hz to 10 Hz
9.5 µV rms, 0.1 Hz to 100 kHz
9 µV rms, 10 Hz to 100 kHz
17 µV rms, 10 Hz to 1 MHz
Low dropout voltage: 150 mV at 200 mA load
Maximum output current: 200 mA
Input voltage range: 2.2 V to 5.5 V
Low quiescent and shutdown current
Initial accuracy: ±1%
Accuracy over line, load, and temperature: −2.5%/+1.5%
5-lead TSOT package and 6-lead LFCSP package
APPLICATIONS
ADC/DAC power supplies
RF, VCO, and PLL power supplies
Post dc-to-dc regulation
GENERAL DESCRIPTION
The ADM7160 is an ultralow noise, low dropout linear
regulator that operates from 2.2 V to 5.5 V and provides up to
200 mA of output current. The low 150 mV dropout voltage at
200 mA load improves efficiency and allows operation over a
wide input voltage range.
Using an innovative circuit topology, the ADM7160 achieves
ultralow noise performance without the need for a bypass
capacitor, making the device ideal for noise-sensitive analog
front-end and RF applications. The ADM7160 also achieves
ultralow noise performance without compromising PSRR or
transient line and load performance.
Current-limit and thermal overload protection circuits prevent
damage under adverse conditions. The ADM7160 also includes
an internal pull-down resistor on the EN input.
Ultralow Noise,
200 mA Linear Regulator
ADM7160
APPLICATION CIRCUIT
VIN = 2.9V
CIN
4.7µF
ADM7160
1 VIN VOUT 5
2 GND
ON
OFF
3 EN
NC 4
NC = NO CONNECT
0V TO VREF
VOUT = 2.5V
COUT
4.7µF
2.5V TO 5V
VDD VREF
IN+ DVDD
16-BIT/18-BIT ADC
IN–
VDD
DIGITAL
OUTPUT
1.8V TO 5V
Figure 1. ADM7160 Powering a 16-Bit/18-Bit ADC
The ADM7160 is specifically designed for stable operation
with tiny 1 µF, ±30% ceramic input and output capacitors to
meet the requirements of high performance, space constrained
applications.
The ADM7160 is available in tiny 5-lead TSOT and 6-lead
LFCSP packages with 16 fixed output voltage options, ranging
from 1.1 V to 3.3 V. The LFCSP offers a very compact solution
that provides excellent thermal performance for applications
that require up to 200 mA of output current in a small, low
profile footprint.
Rev. 0
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rights of third parties that may result from its use. Specifications subject to change without notice. No
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One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2013 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
VIN to GND
VOUT to GND
EN to GND
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
Rating
−0.3 V to +6.5 V
−0.3 V to VIN
−0.3 V to +6.5 V
−65°C to +150°C
−40°C to +125°C
−40°C to +125°C
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADM7160 can be damaged when the junc-
tion temperature limits are exceeded. Monitoring ambient
temperature does not guarantee that TJ is within the specified
temperature limits.
In applications with high power dissipation and poor PCB
thermal resistance, the maximum ambient temperature may
need to be derated. In applications with moderate power
dissipation and low PCB thermal resistance, the maximum
ambient temperature can exceed the maximum limit as long
as the junction temperature is within the specification limits.
The junction temperature (TJ) of the device is dependent on the
ambient temperature (TA), the power dissipation of the device
(PD), and the junction-to-ambient thermal resistance of the
package (θJA). TJ is calculated using the following formula:
TJ = TA + (PD × θJA)
The junction-to-ambient thermal resistance (θJA) of the package
is based on modeling and calculation using a 4-layer board. θJA
is highly dependent on the application and board layout. In appli-
cations where high maximum power dissipation exists, close
attention to thermal board design is required. The value of θJA
may vary, depending on PCB material, layout, and environmental
conditions.
ADM7160
The specified values of θJA are based on a 4-layer, 4 inch × 3 inch
printed circuit board (PCB). See JEDEC JESD51-7 and JESD51-9
for detailed information about board construction. For more infor-
mation about the LFCSP package, see the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame Chip
Scale Package (LFCSP).
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board.
JEDEC JESD51-12, Guidelines for Reporting and Using Electronic
Package Thermal Information, states that thermal characterization
parameters are not the same as thermal resistances. ΨJB measures
the component power flowing through multiple thermal paths,
rather than through a single path as in thermal resistance (θJB).
Therefore, ΨJB thermal paths include convection from the top of
the package, as well as radiation from the package, factors that
make ΨJB more useful in real-world applications.
Maximum junction temperature (TJ) is calculated from the
board temperature (TB) and the power dissipation (PD) using
the following formula:
TJ = TB + (PD × ΨJB)
See JEDEC JESD51-8 and JESD51-12 for more detailed infor-
mation about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
5-Lead TSOT
170
6-Lead LFCSP
63.6
ΨJB
43
28.3
Unit
°C/W
°C/W
ESD CAUTION
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