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Alliance Semiconductor - 128M - 8M x 16 bit Synchronous DRAM

Numéro de référence AS4C8M16S-6TCN
Description 128M - 8M x 16 bit Synchronous DRAM
Fabricant Alliance Semiconductor 
Logo Alliance Semiconductor 





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AS4C8M16S-6TCN fiche technique
AS4C8M16S
Confidential
128M - 8M x 16 bit Synchronous DRAM (SDRAM)
(Rev. 2, Feb. /2014)
Features
Fast access time from clock: 5/5.4 ns
Fast clock rate: 166/143 MHz
Fully synchronous operation
Internal pipelined architecture
2M word x 16-bit x 4-bank
Programmable Mode registers
- CAS Latency: 2, or 3
- Burst Length: 1, 2, 4, 8, or full page
- Burst Type: Sequential or Interleaved
- Burst stop function
Auto Refresh and Self Refresh
4096 refresh cycles/64ms
CKE power down mode
Single +3.3V 0.3V power supply
Interface: LVTTL
Operating temperature range
- Commercial (0 ~ 70°C)
- Industrial (-40 ~ 85°C)
- Automotive A2 (-40 ~ 105°C)
54-pin 400 mil plastic TSOP II package
54-ball 8.0 x 8.0 x 1.2mm (max) FBGA package
All parts ROHS Compliant
Overview
The 128Mb SDRAM is a high-speed CMOS
synchronous DRAM containing 128 Mbits. It is
internally configured as 4 Banks of 2M word x 16
DRAM with a synchronous interface (all signals are
registered on the positive edge of the clock signal,
CLK). Read and write accesses to the SDRAM are
burst oriented; accesses start at a selected location
and continue for a programmed number of locations
in a programmed sequence. Accesses begin with the
registration of a BankActivate command which is then
followed by a Read or Write command.
The SDRAM provides for programmable Read or
Write burst lengths of 1, 2, 4, 8, or full page, with a
burst termination option. An auto precharge function
may be enabled to provide a self-timed row precharge
that is initiated at the end of the burst sequence. The
refresh functions, either Auto or Self Refresh are easy
to use. By having a programmable mode register, the
system can choose the most suitable modes to
maximize its performance. These devices are well
suited for applications requiring high memory
bandwidth and particularly well suited to high
performance PC applications.
Table 1. Key Specifications
AS4C16M16S
tCK3 Clock Cycle time (min.)
tAC3 Access time from CLK (max.)
tRAS Row Active time (min.)
tRC Row Cycle time (min.)
-6/7
6/7 ns
5.4/5.4 ns
42/42 ns
60/63 ns
Table 2. Ordering Information
Part Number
Frequency
Package
AS4C8M16S-7TCN
143 MHz
54 pin TSOP II
AS4C8M16S-6TCN
AS4C8M16S-6TIN
166 MHz
166 MHz
54 pin TSOP II
54 pin TSOP II
AS4C8M16S-6BIN
AS4C8M16S-7BCN
AS4C8M16S-6TAN
T : indicates TSOP II package
B : indicates TFBGA package
166 MHz
143 MHz
166 MHz
54 ball TFBGA
54 ball TFBGA
54 pin TSOP II
N : indicates Pb free and Halogen free ROHS compliant parts
C: Commercial I: Industrial A: Automotive temperatures
Confidential
1
Rev. 2
Feb. /2014

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