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Número de pieza | M2F2G64CB88BHN | |
Descripción | Unbuffered DDR3 SDRAM DIMM | |
Fabricantes | Nanya | |
Logotipo | ||
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No Preview Available ! M2F2G64CB88B7N / M2F4G64CB8HB5N
M2F2G64CB88BHN / M2F4G64CB8HB9N
2GB: 256M x 64 / 4GB: 512M x 64PC3-8500 / PC3-10600/PC-12800
Unbuffered DDR3 SDRAM DIMM
Based on DDR3-1066/1333/1600 256Mx8 (2GB/4GB) SDRAM B-Die
Features
•Performance:
Speed Sort
PC3-8500 PC3-10600 PC3-12800
-BE -CG
-DI Unit
DIMM CAS Latency
7 9 11
fck – Clock Frequency
533 667
800
tck – Clock Cycle
1.875
1.5
1.25
fDQ – DQ Burst Frequency 1066
1333
1600
• 240-Pin Dual In-Line Memory Module (UDIMM)
• 256Mx64 (2GB) / 512Mx64 (4GB) DDR3 Unbuffered DIMM
based on 256Mx8 DDR3 SDRAM B-Die devices.
• Intended for 533MHz/667MHz/800MHz applications
• Inputs and outputs are SSTL-15 compatible
• VDD = VDDQ = 1.5V ±0.075V
• SDRAMs have 8 internal banks for concurrent operation
• Differential clock inputs
• Data is read or written on both clock edges
• DRAM DLL aligns DQ and DQS transitions with clock transitions.
• Address and control signals are fully synchronous to positive
clock edge
• Nominal and Dynamtic On-Die Termination support
• Halogen free product
MHz
ns
Mbps
• Programmable Operation:
- DIMM Latency: 6,7,8,9,10,11
- Burst Type: Sequential or Interleave
- Burst Length: BC4, BL8
- Operation: Burst Read and Write
• Two different termination values (Rtt_Nom & Rtt_WR)
• 15/10/1 (row/column/rank) Addressing for 2GB
• 15/10/2 (row/column/rank) Addressing for 4GB
• Extended operating temperature rage
• Auto Self-Refresh option
• Serial Presence Detect
• Gold contacts
• 2GB/4GB SDRAMs are in 78-ball BGA Package
• RoHS compliance and Halogen free
Description
M2F2G64CB88B7N / M2F4G64CB8HB5N / M2F2G64CB88BHN / M2F4G64CB8HB9N are 240-Pin Double Data Rate 3 (DDR3)
Synchronous DRAM Unbuffered Dual In-Line Memory Module (UDIMM), organized as one rank of 256Mx64 (2GB) and two ranks of
512Mx64 (4GB) high-speed memory array. Modules use eight 256Mx8 (2GB) 78-ball BGA packaged devices and sixteen 256Mx8 (4GB)
78-ball BGA packaged devices. These DIMMs are manufactured using raw cards developed for broad industry use as reference designs.
The use of these common design files minimizes electrical variation between suppliers. All Elixir DDR3 SDRAM DIMMs provide a
high-performance, flexible 8-byte interface in a 5.25” long space-saving footprint.
The DIMM is intended for use in applications operating of 533MHz/667MHz/800MHz clock speeds and achieves high-speed data transfer
rates of 1066Mbps/1333Mbps/1600Mbps. Prior to any access operation, the device latency and burst/length/operation type must be
programmed into the DIMM by address inputs A0-A14 (2GB/4GB) and I/O inputs BA0~BA2 using the mode register set cycle.
The DIMM uses serial presence-detect implemented via a serial EEPROM using a standard IIC protocol. The first 128 bytes of SPD data
are programmed and locked during module assembly. The remaining 128 bytes are available for use by the customer.
Ordering Information
REV 1.1
10/2010
1
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
1 page M2F2G64CB88B7N / M2F4G64CB8HB5N
M2F2G64CB88BHN / M2F4G64CB8HB9N
2GB: 256M x 64 / 4GB: 512M x 64PC3-8500 / PC3-10600/PC-12800
Unbuffered DDR3 SDRAM DIMM
Functional Block Diagram
[2GB – 1 Rank, 256Mx8 DDR3 SDRAMs]
DQS0
DM0
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D0
ZQ
DQS1
DM1
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D1
ZQ
DQS2
DM2
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D2
ZQ
DQS3
DM3
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D3
ZQ
DQS4
DM4
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQS5
DM5
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQS6
DM6
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQS7
DM7
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D4
ZQ
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D5
ZQ
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D6
ZQ
DM
I/O 0
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 6
I/O 7
DQS
D7
ZQ
SCL
SA0
SA1
SCL
A0
A1
A2
SPD
WP
CKE0, A[13:0],
, , ,
ODT0, BA[2:0],
CK
DDR3
SDRAM
DDR3
SDRAM
REV 1.1
10/2010
SDA
VTT
VDD
VDDSPD
VDD/VDDQ
VREFDQ
VSS
VREFCA
BA0-BA2
A0-A13
CKE0
ODT0
CK0
SPD
D0-D7
D0-D7
D0-D7
D0-D7
BA0-BA2: SDRAMs D0-D7
A0-A13: SDRAMs D0-D7
: SDRAMs D0-D7
: SDRAMs D0-D7
CKE: SDRAMs D0-D7
: SDRAMs D0-D7
ODT: SDRAMs D0-D7
CK: SDRAMs D0-D7
: SDRAMs D0-D7
: SDRAMs D0-D7
Notes :
1. DQ-to-I/O wiring is shown as recommended but may be changed.
2. DQ/DQS/DQS/ODT/DM/CKE/S relationships must be maintained as shown.
3. For each DRAM, a unique ZQ resistor is connected to ground. The ZQ
resistor is 240Ω±1%.
4. One SPD exists per module.
5
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
5 Page M2F2G64CB88B7N / M2F4G64CB8HB5N
M2F2G64CB88BHN / M2F4G64CB8HB9N
2GB: 256M x 64 / 4GB: 512M x 64PC3-8500 / PC3-10600/PC-12800
Unbuffered DDR3 SDRAM DIMM
Operating, Standby, and Refresh Currents
TCASE = 0 °C ~ 85 °C; VDDQ = VDD = 1.5V ± 0.075V [2GB – 1 Rank, 256Mx8 DDR3 SDRAMs]
Symbol
IDD0
IDD1
IDD2P0
IDD2P1
IDD2Q
IDD2N
IDD3P
IDD3N
IDD4R
IDD4W
IDD5B
IDD6
IDD7
Parameter/Condition
Operating One Bank Active-Precharge Current
Operating One Bank Active-Read-Precharge Current
Precharge Power-Down Current Slow Exit
Precharge Power-Down Current Fast Exit
Precharge Quiet Standby Current
Precharge Standby Current
Active Power-Down Current
Active Standby Current
Operating Burst Read Current
Operating Burst Write Current
Burst Refresh Current
Self Refresh Current: Normal Temperature Range
Operating Bank Interleave Read Current
PC3-8500
(-BE)
577
725
33
104
167
182
114
236
1011
1028
1531
83
2590
Operating, Standby, and Refresh Currents
TCASE = 0 °C ~ 85 °C; VDDQ = VDD = 1.5V ± 0.075V [4GB – 2 Ranks, 256Mx8 DDR3 SDRAMs]
Symbol
IDD0
IDD1
IDD2P0
IDD2P1
IDD2Q
IDD2N
IDD3P
IDD3N
IDD4R
IDD4W
IDD5B
IDD6
IDD7
Parameter/Condition
Operating One Bank Active-Precharge Current
Operating One Bank Active-Read-Precharge Current
Precharge Power-Down Current Slow Exit
Precharge Power-Down Current Fast Exit
Precharge Quiet Standby Current
Precharge Standby Current
Active Power-Down Current
Active Standby Current
Operating Burst Read Current
Operating Burst Write Current
Burst Refresh Current
Self Refresh Current: Normal Temperature Range
Operating Bank Interleave Read Current
PC3-8500
(-BE)
813
961
66
209
333
364
228
472
1247
1264
1767
167
2826
PC3-10600
(-CG)
579
750
48
132
204
220
144
231
1302
1239
1507
56
2997
PC3-10600
(-CG)
810
980
95
264
408
440
289
461
1533
1470
1737
113
3228
PC3-12800
(-DI)
609
790
51
143
185
243
158
255
1510
1438
1531
56
3062
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
PC3-12800
(-DI)
864
1045
102
285
370
486
317
510
1765
1693
1786
113
3318
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
REV 1.1
10/2010
11
© NANYA TECHNOLOGY CORPORATION
NANYA reserves the right to change products and specifications without notice.
11 Page |
Páginas | Total 27 Páginas | |
PDF Descargar | [ Datasheet M2F2G64CB88BHN.PDF ] |
Número de pieza | Descripción | Fabricantes |
M2F2G64CB88BHN | Unbuffered DDR3 SDRAM DIMM | Nanya |
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