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PDF FDMA507PZ Data sheet ( Hoja de datos )

Número de pieza FDMA507PZ
Descripción Single P-Channel PowerTrench MOSFET
Fabricantes Fairchild Semiconductor 
Logotipo Fairchild Semiconductor Logotipo



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No Preview Available ! FDMA507PZ Hoja de datos, Descripción, Manual

May 2010
FDMA507PZ
Single P-Channel PowerTrench® MOSFET
-20 V, -7.8 A, 24 m
Features
General Description
„ Max rDS(on) = 24 mat VGS = -5 V, ID = -7.8 A
„ Max rDS(on) = 25 mat VGS = -4.5 V, ID = -7 A
„ Max rDS(on) = 35 mat VGS = -2.5 V, ID = -5.5 A
„ Max rDS(on) = 45 mat VGS = -1.8 V, ID = -4 A
„ Low Profile - 0.8 mm maximum - in the package MicroFET
2X2 mm
„ HBM ESD protection level > 3.2K V typical (Note3)
„ Free from halogenated compounds and antimony oxides
„ RoHS Compliant
This device is designed specifically for battery charge or load
switching in cellular handset and other ultraportable applications.
It features a MOSFET with low on-stade resistance.
The MicroFET 2X2 package offers exceptional thermal
perfomance for its physical size and is well suited to linear mode
applications.
MOSFET Maximum Ratings TA = 25 °C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Pulsed
TA = 25 °C
Power Dissipation
TA = 25 °C
Power Dissipation
TA = 25 °C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 1a)
(Note 1b)
Ratings
-20
±8
-7.8
-24
2.4
0.9
-55 to +150
Units
V
V
A
W
°C
RθJA
RθJA
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
(Note 1b)
52
145
°C/W
Device Marking
507
Device
FDMA507PZ
Package
MicroFET 2X2
Reel Size
7 ’’
Tape Width
12 mm
Quantity
3000 units
©2010 Fairchild Semiconductor Corporation
FDMA507PZ Rev.C
1
www.fairchildsemi.com

1 page




FDMA507PZ pdf
Typical Characteristics TJ = 25 °C unless otherwise noted
2
1
0.1
0.01
0.001
10-4
DUTY CYCLE-DESCENDING ORDER
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
RθJA = 145 oC/W
PDM
t1
t2
NOTES:
DUTY FACTOR: D = t1/t2
PEAK TJ = PDM x ZθJA x RθJA + TA
10-3
10-2
10-1
1
10
t, RECTANGULAR PULSE DURATION (sec)
100
Figure 12. Junction-to-Ambient Transient Thermal Response Curve
1000
©2010 Fairchild Semiconductor Corporation
FDMA507PZ Rev.C
5
www.fairchildsemi.com

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