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Numéro de référence | SiA511DJ | ||
Description | N- and P-Channel 12-V (D-S) MOSFET | ||
Fabricant | Vishay | ||
Logo | |||
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SiA511DJ
Vishay Siliconix
N- and P-Channel 12-V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.040 at VGS = 4.5 V
N-Channel 12 0.048 at VGS = 2.5 V
0.063 at VGS = 1.8 V
0.070 at VGS = - 4.5 V
P-Channel - 12 0.100 at VGS = - 2.5 V
0.140 at VGS = - 1.8 V
PowerPAK SC-70-6 Dual
ID (A)
4.5a
4.5a
4.5a
- 4.5a
- 4.5a
- 4.5a
Qg (Typ.)
4.5 nC
5 nC
FEATURES
• Halogen-free
• TrenchFET® Power MOSFETs
• New Thermally Enhanced PowerPAK®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
APPLICATIONS
• Load Switch for Portable Devices
RoHS
COMPLIANT
1
S1
2
G1
D1
3
D2
D1
6
D2
G2
5
2.05 mm S2
4
2.05 mm
Marking Code
Part # code
EAX
XXX
Lot Traceability
and Date code
Ordering Information: SiA511DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
D1 S2
G2
G1
S1 D2
N-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
N-Channel
P-Channel
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Pulsed Drain Current
Source Drain Current Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
VDS
VGS
ID
IDM
IS
PD
TJ, Tstg
12 - 12
±8
4.5a - 4.5a
4.5a - 4.5a
4.5a, b, c
- 4.3b, c
4.5a, b, c
- 3.4b, c
20 - 10
4.5a - 4.5a
1.6b, c
- 1.6b, c
6.5 6.5
55
1.9b, c
1.9b, c
1.2b, c
1.2b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
N-Channel
P-Channel
Parameter
Symbol
Typ. Max. Typ. Max.
Unit
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t≤5s
Steady State
RthJA
RthJC
52 65 52 65
12.5 16 12.5 16
°C/W
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (http://www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 74592
S-80436-Rev. B, 03-Mar-08
www.vishay.com
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Pages | Pages 12 | ||
Télécharger | [ SiA511DJ ] |
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