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Vishay - Dual P-Channel 20 V (D-S) MOSFET

Numéro de référence SiA907EDJT
Description Dual P-Channel 20 V (D-S) MOSFET
Fabricant Vishay 
Logo Vishay 





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SiA907EDJT fiche technique
www.vishay.com
SiA907EDJT
Vishay Siliconix
Dual P-Channel 20 V (D-S) MOSFET
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.057 at VGS = -4.5 V
-20
0.095 at VGS = -2.5 V
ID (A)
-4.5 a
-4.5 a
Qg (TYP.)
4.9 nC
PowerPAK® SC-70-6L Dual
D1
G2 6
S2 5
4
D2
D1
1 2.05 mm
Top View
2
3 G1
D2
Bottom View
1
S1
Marking Code: DM
Ordering Information:
SiA907EDJT-T1-GE3 (Lead (Pb)-free and Halogen-free)
SiA907EDJT-T4-GE3 (Lead (Pb)-free and Halogen-free)
FEATURES
• TrenchFET® power MOSFET
• Thermally enhanced Thin PowerPAK® SC-70
package
- Small footprint area
- Low on-resistance
• Typical ESD protection: 1500 V HBM
• High speed switching
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Charger Switch, Load Switch for Portable Devices
• Battery Management
S1 S2
G1 G2
P-Channel MOSFET
D1
P-Channel MOSFET
D2
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
TA = 70 °C
Pulsed Drain Current (t = 300 μs)
IDM
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
TJ, Tstg
LIMIT
-20
± 12
-4.5 a
-4.5 a
-4.5 a, b, c
-3.8 b, c
-15
-4.5 a
-1.6 b, c
7.8
5
1.9 b, c
1.2 b, c
-55 to 150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient b, f
Maximum Junction-to-Case (Drain)
t5s
Steady State
RthJA
RthJC
52
12.5
65
°C/W
16
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The Thin PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: Manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 110 °C/W.
S14-0624-Rev. B, 24-Mar-14
1
Document Number: 67874
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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