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Vishay - Dual P-Channel 12-V (D-S) MOSFET

Numéro de référence SiA975DJ
Description Dual P-Channel 12-V (D-S) MOSFET
Fabricant Vishay 
Logo Vishay 





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SiA975DJ fiche technique
New Product
Dual P-Channel 12-V (D-S) MOSFET
SiA975DJ
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
0.041 at VGS = - 4.5 V
- 12 0.060 at VGS = - 2.5 V
0.110 at VGS = - 1.8 V
ID (A)
- 4.5a
- 4.5a
- 3.5
Qg (Typ.)
10.5 nC
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• New Thermally Enhanced PowerPAK®
SC-70 Package
- Small Footprint Area
- Low On-Resistance
• 100 % Rg Tested
Compliant to RoHS directive 2002/95/EC
PowerPAK SC-70-6 Dual
APPLICATIONS
• Load Switch, PA Switch and Battery Switch for Portable
Devices and Game Consoles
1
S1
2
G1
D1
3
D2
D1
6
D2
G2
5
2.05 mm S2
4
2.05 mm
Marking Code
Part # code
DJX
XXX
Lot Traceability
and Date Code
S1 S2
G1 G2
D1 D2
Ordering Information: SiA975DJ-T1-GE3 (Lead (Pb)-free and Halogen-free)
P-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
TC = 25 °C
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
TA = 70 °C
Pulsed Drain Current
IDM
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
PD
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
TJ, Tstg
Limit
- 12
±8
- 4.5a
- 4.5a
- 4.5a,b, c
- 4.4b, c
- 15
- 4.5a
- 1.6b, c
7.8
5
1.9b, c
1.2b, c
- 55 to 150
260
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
Maximum Junction-to-Case (Drain)
t5s
Steady State
RthJA
RthJC
52
12.5
65 °C/W
16
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile (www.vishay.com/ppg?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 110 °C/W.
Document Number: 65710
S10-0213-Rev. A, 25-Jan-10
www.vishay.com
1

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