LL1005-FH47NJ Datasheet PDF - TOKO
| Part Number | LL1005-FH47NJ | |
| Description | Multilayer Chip Inductors | |
| Manufacturers | TOKO | |
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Multilayer Chip Inductors
LL1005-FH
Series
TYPE LL1005-FH Series
Inductance Range: 1.0~100nH (E-12)
Temperature Coefficient of L: + 250ppm/°C typical
DIMENSIONS /
Length
(mm)
1.0 ± 0.1
Width
(mm)
0.5 ± 0.1
Thickness
(mm)
0.5 ± 0.1
Electrode width
A (mm)
0.25 ± 0.1
• Marking of polarity: Marking is on the upper Surface
of the unit.
•
Marking of polarity
Marking: Blue Green
L
W
T
A
ELECTRICAL CHARACTERISTICS /
• Inductance Range
1.0~100nH (E-12 Series)
• Inductance Tolerance S ; ± 0.3nH (1.0~5.6nH)
J ; ± 5% (6.8~100nH)
K ; ± 10% (3.3~100nH)
• Q (Typ.)
20~34 (at 800MHz)
• Rated Current
150~300mA
• L Temperature
Coefficient (Typ.)
+ 250ppm/°C
• Applicable Temperature
Range
− 40~+ 100°C
PART NUMBERING SYSTEM /
L L 1 0 0 5—F H
Material /
Physical Dimensions /
TOKO's Type name /
Inductance
Unit is nH and 3 digits are used.
The value is indicated as shown below.
Example / 4N7…4.7nH, 27N…27nH
SOLDERING CONDITIONS /
Recommended Pattern
c
b ab
•
•
• 20 ~ 34 (at 800MHz)
•
•
•
Tolerance /
Inductance /
Tolerance for the Inductance
Mark
S
J
K
Tolerance
± 0.3nH
± 5%
± 10%
Pattern Dimensions (unit: mm)
Flow Soldering
Reflow Soldering
a 0.3~0.5
0.3~0.5
b 0.4~0.5
0.3~0.5
c 0.3~0.5
0.3~0.4
Conditions for soldering temperatures are determined as per figures below after prior confirmation that abnormalities are not
evident.
Flow Soldering
7s.
230±5°C
80±20°C
2min.
Reflow Soldering
240°C
225°C
20s.
140~170°C
80s.
2min.
Soldering Iron
2s.
250± 10°C
150± 10°C
2min.
Soldering Iron rating:18W
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MULTILAYER AND CHICK CHIP INDUCTORS
PRECAUTIONS FOR USING CHIP INDUCTORS
1. Precaution for Application
1.1 Parts must be pre-heated before soldering if
reflow or flow solder is applied.
The difference between pre-heat temperature
and soldering temperature must be within 150°C.
1.2 If a soldering iron is applied, the soldering must
be completed within 3 seconds at a temperature
lower than 260°C.
The tip of the soldering iron must not touch the
terminal electrode in this process.
1.3 Soldering by using an iron must be only once for
the same part.
1.4 This part, when PCB-mounted, must be handled
with care to minimize any physical stress to the
part at board assembly process.
1.5 To minimize the effects on the part, the thickness
of PCB, land dimension, and the amount of
solder must be evaluated carefully by individual
application.
1.6 CFC, triethane, and isopropyl used for the
washing process will not affect part performance.
2. Precaution of Storage
Storage conditions are critical to maintain
optimum soldering performance.
2.1 Environmental Requirements:
Control ambient temperature at or under 40°C
and 70%RH.
Products should be used within 6 months.
2.2 Influence of harmful Gas:
Store the products in a place isolated from
harmful gases like sulfur and chlorine.
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