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Vishay Siliconix - N-Channel 40-V (D-S) MOSFET

Numéro de référence SIE832DF
Description N-Channel 40-V (D-S) MOSFET
Fabricant Vishay Siliconix 
Logo Vishay Siliconix 





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SIE832DF fiche technique
N-Channel 40-V (D-S) MOSFET
SiE832DF
Vishay Siliconix
PRODUCT SUMMARY
ID (A)a
VDS (V)
RDS(on) (Ω)
Silicon Package
Limit Limit Qg (Typ.)
0.0055 at VGS = 10 V 103
40
0.007 at VGS = 4.5 V
91
50
25 nC
50
Package Drawing
www.vishay.com/doc?73398
PolarPAK
10 9 8 7 6
D GS S D
67
8 9 10
D D S GD
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• Ultra Low Thermal Resistance Using Top-
Exposed PolarPAK® Package for Double-
Sided Cooling
• Leadframe-Based New Encapsulated Package
- Die Not Exposed
- Same Layout Regardless of Die Size
• Low Qgd/Qgs Ratio Helps Prevent Shoot-Through
• 100 % Rg and UIS Tested
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• VRM
• Point-of-Load
• Synchronous Rectification
D
G
D GS S D
1 23 4 5
54
32 1
Top View
Bottom View
Top surface is connected to pins 1, 5, 6, and 10
Ordering Information: SiE832DF-T1-E3 (Lead (Pb)-free)
SiE832DF-T1-GE3 (Lead (Pb)-free and Halogen-free)
S
N-Channel MOSFET
For Related Documents
www.vishay.com/ppg?74414
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
40
± 20
V
TC = 25 °C
103 (Silicon Limit)
50a (Package Limit)
Continuous Drain Current (TJ = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
Single Pulse Avalanche Current
Avalanche Energy
TC = 70 °C
TA = 25 °C
TA = 70 °C
TC = 25 °C
TA = 25 °C
L = 0.1 mH
ID
IDM
IS
IAS
EAS
50a
23.6b, c
18.9b, c
80
50a
4.3b, c
35
61
A
mJ
TC = 25 °C
Maximum Power Dissipation
TC = 70 °C
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
PD
TJ, Tstg
104
66
5.2b, c
3.3b, c
- 55 to 150
260
W
°C
Notes:
a. Package limited is 50 A.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 74414
S09-1338-Rev. C, 13-Jul-09
www.vishay.com
1

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