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Power Integrations - Integrated Off-Line Switcher with EcoSmart Technology

Numéro de référence TOP267VG
Description Integrated Off-Line Switcher with EcoSmart Technology
Fabricant Power Integrations 
Logo Power Integrations 





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TOP267VG fiche technique
TOP264-271
TOPSwitch-JX Family
Integrated Off-Line Switcher with EcoSmartTechnology
for Highly Efficient Power Supplies
Product Highlights
EcoSmart – Energy Efficient
Ideal for applications from 10 W to 245 W
Energy efficient over entire load range
No-load consumption below 100 mW at 265 VAC
Up to 750 mW standby output power for 1 W input at 230 VAC
High Design Flexibility for Low System Cost
Multi-mode PWM control maximizes efficiency at all loads
132 kHz operation reduces transformer and power supply size
66 kHz option for highest efficiency requirements
Accurate programmable current limit
Optimized line feed-forward for line ripple rejection
Frequency jittering reduces EMI filter cost
Fully integrated soft-start for minimum start-up stress
725 V rated MOSFET
Simplifies meeting design derating requirements
AC
IN
DV
TOPSwitch-JX
CONTROL
C
S XF
Figure 1. Typical Flyback Application.
+
DC
OU-T
PI-5578-090309
Extensive Protection Features
Auto-restart limits power delivery to <3% during overload faults
Output short-circuit protection (SCP)
Output over-current protection (OCP)
Output overload protection (OPP)
Output overvoltage protection (OVP)
User programmable for hysteretic/latching shutdown
Simple fast AC reset
Primary or secondary sensed
Line undervoltage (UV) detection prevents turn-off glitches
Line overvoltage (OV) shutdown extends line surge withstand
Accurate thermal shutdown with large hysteresis (OTP)
Advanced Package Options
eDIP-12 package:
43 W / 117 W universal input power output capability with
PCB / metal heat sink
Low profile horizontal orientation for ultra-slim designs
Heat transfer to both PCB and heat sink
Optional external heat sink provides thermal impedance
equivalent to a TO-220
eSIP-7C package:
177 W universal input output power capability
Vertical orientation for minimum PCB footprint
Simple heat sink mounting using clip provides thermal
impedance equivalent to a TO-220
eSOP-12 package:
66 W universal input output power capability
Low profile surface mounted for ultra-slim designs
Heat transfer to PCB via exposed pad and SOURCE pins
Supports wave or reflow soldering
Extended creepage to DRAIN pin
Heat sink is connected to SOURCE for low EMI
eSIP-7C (E Package) eSOP-12B (K Package)
Figure 2. Package Options.
eDIP-12B (V Package)
Description
TOPSwitch-JX cost effectively incorporates a 725 V power
MOSFET, high-voltage switched current source, multi-mode
PWM control, oscillator, thermal shutdown circuit, fault
protection and other control circuitry onto a monolithic device.
Typical Applications
Notebook or laptop adapter
Generic adapter
Printer
LCD monitor
Set-top box
PC or LCD TV standby
Audio amplifier
Output Power Ratings
See next page.
www.powerint.com
August 2012

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