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Numéro de référence | NSVT45011MW6T3G | ||
Description | Dual Matched General Purpose Transistor | ||
Fabricant | ON Semiconductor | ||
Logo | |||
1 Page
NST45011MW6T1G,
NSVT45011MW6T3G
Dual Matched General
Purpose Transistor
NPN Matched Pair
These transistors are housed in an ultra−small SOT−363 package
ideally suited for portable products. They are assembled to create a
pair of devices highly matched in all parameters, eliminating the need
for costly trimming. Applications are Current Mirrors; Differential,
Sense and Balanced Amplifiers; Mixers; Detectors and Limiters.
Features
• Current Gain Matching to 10%
• Base−Emitter Voltage Matched to 2 mV
• Drop−In Replacement for Standard Device
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector −Emitter Voltage
VCEO
45
V
Collector −Base Voltage
VCBO
50
V
Emitter −Base Voltage
VEBO
6.0
V
Collector Current − Continuous
IC 100 mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Total Device Dissipation
Per Device
FR−5 Board (Note 1)
TA = 25°C
Derate Above 25°C
PD
Thermal Resistance,
Junction to Ambient
RqJA
Junction and Storage
Temperature Range
TJ, Tstg
1. FR−5 = 1.0 x 0.75 x 0.062 in
Max
380
250
3.0
328
−55 to +150
Unit
mW
mW/°C
°C/W
°C
http://onsemi.com
SOT−363
CASE 419B
STYLE 1
(3) (2) (1)
Q1 Q2
(4) (5)
(6)
MARKING DIAGRAMS
2F MG
G
2F = Device Code
M = Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping†
NST45011MW6T1G
SOT−363
3,000 /
(Pb−Free) Tape & Reel
NSVT45011MW6T3G SOT−363 10,000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. 4
1
Publication Order Number:
NST45011MW6/D
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Pages | Pages 5 | ||
Télécharger | [ NSVT45011MW6T3G ] |
No | Description détaillée | Fabricant |
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