|
|
PDF SMD5730 Data sheet ( Hoja de datos )
| Número de pieza | SMD5730 | |
| Descripción | LED | |
| Fabricantes | SANPU | |
| Logotipo |  |
|
Hay una vista previa y un enlace de descarga de SMD5730 (archivo pdf) en la parte inferior de esta página. Total 12 Páginas | ||
|
No Preview Available !
SMD 5730 Series Data Sheet
◆Features/特性
Super high efficiency
High reliability performance
Viewing angle 120°
Suitable for all SMT assembly and solder process
Complied with ROHS directive
高光效
高可靠性
角度 120 度
适合所有 SMT 组装及焊接工艺
符合 ROHS 指令要求
◆Product Definition Code/LED 产品命名原则：
① ② ③ ④⑤⑥ ⑦⑧ ⑨ ⑩⑪
SP 5730 □□ □□Х □Х ХХ Х□
色温段/CCT
显色指数/Ra
光通量/Luminous flux
支架版本/Leadfram version
支架供应商/Leadfram supplier
芯片颗数/Die QTY
芯片尺寸/Die size
芯片供应商/Die supplier
发光颜色/Lighting color
封装形式/Package type
三浦半导体/Company
地址: 深圳市宝安区福永街道福园一路高新 技术工业园第二栋 电话: 86-755-33935557 33935558
传真: 86-755-33935559 E-mail:[email protected] [email protected]
1/12
1 page  
◆ Reliability Test Items/可靠度测试项目:
Item
No.
测试项目
Condition
测试条件
Time/Cycle
Number of
Damaged
测试时间或周期 不良数/测试数
1
Temperature Cycle Test
-40℃→25℃→+100℃→25℃；
30min，5min
200 Cycles
温度循环测试
0/50
High Temp. Storage
2
高温储存
100 oC
1000Hrs
0/50
Low Temp. Storage
3
低温储存
High Temp. High Humidity
Storage
4
高温高湿储存
-40 oC
60 oC, 90 % RH
1000Hrs
0/50
1000Hrs
0/50
Operation Life Test
5
常温寿命老化
Room Temp., 150mA
1000Hrs
0/50
Low Temp. Operation Life Test
6
低温寿命老化
-30 oC , 150mA
1000 Hrs
0/50
High Temp. Operation Life Test
7
高温寿命老化
85 oC , 150mA
High Temp.High Humidity
Operation Life Test
8 60 oC, 90 % RH IF=150mA
高温高湿寿命老化
1000 Hrs
1000 Hrs
0/50
0/50
Soldering Heat Test
9
耐旱性（回流焊）
Solderability
10
可焊性
260±5 oC/10s
235℃/5s
2sec
1 sec
0/50
0/50
地址: 深圳市宝安区福永街道福园一路高新 技术工业园第二栋 电话: 86-755-33935557 33935558
传真: 86-755-33935559 E-mail:[email protected] [email protected]
5/12
5 Page 
◆Caution/注意事项：
1、Before opening the package： the LED should be kept at 30oC or less and 90 % RH or less.
打开包装前请在温度 30 oC 湿度 90%的环境以下储存。
2、After openning the package ：the LED should be kept at 30 oC or less and 30%RH or less.The LED
should be soldered with in 168h( 7days)after opening the package. If unused LEDs remain，they
should be stored in moisture proof package，such as sealed containers with packages of moisture
absorbent material(silica gel). It is also recommended to return the LEDs to the original moisture proof
bag and to seal the moisture bag again.
打开包装后，LED 请在温度 30 oC 湿度 60%的环境以下储存，并应在 168 小时内完成焊接。如果包装打开
后，未用完的 LED 应放置在防潮包装中，比如含有防潮剂（硅胶）的袋子中。建议将此 LED 返回到原
始包装带中并将其封口。
3、After openning the package ,If the humidity indicator’s color change from blue to pink at 30% or more,
and if the LEDs have exceed the storage time, bake treatment should be performed using the
following conditions.baking treatment :more than 24 hours at 60±5 oC。
打开包装后，如果发现湿度指示卡的颜色由蓝色变为粉红色并且是在 30%（含 30%）以上，或者产品超
过储存时间，干燥处理如下：60±5 oC，24 小时以上。
4、The LED is an ESD sensitive device. All the equipment and machine must be properly grounded.
LED 是静电敏感器件，使用时所有设备、机构都需有适当的接地导电措施。
5、When make use of it,please use static-free container,operator showld ware antistatic clothes and
rope-satic-ring also should make effective ground
使用时请使用防静电的盛装容器，作业人员应穿着防静电服装及佩戴有绳之静电环并作有效接地。
6、Damaged device will appear some symptoms,lower forward voltage,higher leak current,or even short
current.
受静电与突波破坏之 LED 电性特性上，会有明显的漏电流，或驱动电压明显变低，甚至是短路现象。
7、After soldering the LED should keep out off any shake or outer force before it come to normal tempreture
上在焊接温度回到正常以前，必须避免使 LED 受到任何震动或外力。
8、Reflow soldering should not be done more than two times,when soldering,do not put stress on the LEDs
during heating.After soldering,do not warp the circuit board.。Repair should not be done after the LEDs
have been soldered. When repairing is unavoidable,a double-head soldering iron shoud be used. It
should be confirmed before hand whether the characteristics of the LEDs will not be damaged by
repairing.
LED 不宜过两次回流焊接，在高温焊接期间，不要在 LED 表面施压。LED 焊接后，不要弯曲线路板。LED
焊接后不宜进行返修，当返修不可避免时，请事先确认返修是否使 LED 的特性受到破坏，再确定是否
使用双头烙铁进行返修。
9、LED is one-way continuity, please check electrode before mount, if mount wrong ,the LED chip will
damage or fail when LED applied voltage
LED 单向导通性，安装前确认极性，若装反，在施加电压时容易造成 LED 芯片损伤或失效。
10、Please design the PCB board to keep a distance between LED and other emit heat component
线路设计时，请尽量避免将 LED 与发热组件靠得过近。
11、Strongly recommend design the board according setting current other than setting voltage .if you are
really need setting voltage type please consider there may cause influence arise by difference voltage
of difference LED
电路设计上，建议以定电流设计，若为定电压设计，请考虑 LED 之间不同正向电压所可能造成之影响。
12、The outer voltage change will bring the current index change .unsuitable design and current control,easy
cause LED fail .for example excess current will cause LED life short or even burn down , too little
地址: 深圳市宝安区福永街道福园一路高新 技术工业园第二栋 电话: 86-755-33935557 33935558
传真: 86-755-33935559 E-mail:[email protected] [email protected]
11/12
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet SMD5730.PDF ] | |
Hoja de datos destacado
| Número de pieza | Descripción | Fabricantes |
| SMD5730 | LED | SANPU |
| Número de pieza | Descripción | Fabricantes |
| SLA6805M | High Voltage 3 phase Motor Driver IC. |
 Sanken |
| SDC1742 | 12- and 14-Bit Hybrid Synchro / Resolver-to-Digital Converters. |
 Analog Devices |
|
DataSheet.es es una pagina web que funciona como un repositorio de manuales o hoja de datos de muchos de los productos más populares, |
| DataSheet.es | 2020 | Privacy Policy | Contacto | Buscar |