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PDF MPC870 Data sheet ( Hoja de datos )
| Número de pieza | MPC870 | |
| Descripción | PowerQUICC Hardware Specifications | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Freescale Semiconductor
Technical Data
Document Number: MPC875EC
Rev. 4, 08/2007
MPC875/MPC870 PowerQUICC™
Hardware Specifications
This hardware specification contains detailed information on
power considerations, DC/AC electrical characteristics, and
AC timing specifications for the MPC875/MPC870. The
CPU on the MPC875/MPC870 is a 32-bit core built on
Power Architecture™ technology that incorporates memory
management units (MMUs) and instruction and data caches.
For functional characteristics of the MPC875/MPC870, refer
to the MPC885 PowerQUICC™ Family Reference Manual.
To locate published errata or updates for this document, refer
to the MPC875/MPC870 product summary page on our
website listed on the back cover of this document or, contact
your local Freescale sales office.
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 9
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 10
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7. Thermal Calculation and Measurement . . . . . . . . . . 12
8. Power Supply and Power Sequencing . . . . . . . . . . . 14
9. Mandatory Reset Configurations . . . . . . . . . . . . . . . 15
10. Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11. Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 17
12. IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 45
13. CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 47
14. USB Electrical Characteristics . . . . . . . . . . . . . . . . . 67
15. FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 67
16. Mechanical Data and Ordering Information . . . . . . . 71
17. Document Revision History . . . . . . . . . . . . . . . . . . . 80
© Freescale Semiconductor, Inc., 2003–2007. All rights reserved.
1 page  
Features
— HDLC bus (implements an HDLC-based local area network (LAN))
— Asynchronous HDLC to support point-to-point protocol (PPP)
— AppleTalk
— Universal asynchronous receiver transmitter (UART)
— Synchronous UART
— Serial infrared (IrDA)
— Binary synchronous communication (BISYNC)
— Totally transparent (bit streams)
— Totally transparent (frame based with optional cyclic redundancy check (CRC))
• SMC (serial management channel)
— UART (low-speed operation)
— Transparent
• Universal serial bus (USB)—Supports operation as a USB function endpoint, a USB host
controller, or both for testing purposes (loopback diagnostics)
— USB 2.0 full-/low-speed compatible
— The USB function mode has the following features:
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— The USB host controller has the following features:
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and
data rate configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
• Serial peripheral interface (SPI)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
• Inter-integrated circuit (I2C) port
— Supports master and slave modes
— Supports a multiple-master environment
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Freescale Semiconductor
5
5 Page 
Power Dissipation
5 Power Dissipation
Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are
equal, and 2:1, where CPU frequency is twice bus speed.
Die Revision
Table 5. Power Dissipation (PD)
Bus Mode
Frequency
Typical1
Maximum2
Unit
0
1:1 66 MHz 310
390
80 MHz
350
430
2:1 133 MHz 430
495
1 Typical power dissipation is measured at VDDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V.
2 Maximum power dissipation at VDDL = VDDSYN = 1.9 V, and VDDH is at 3.5 V.
mW
mW
mW
NOTE
The values in Table 5 represent VDDL-based power dissipation and do not
include I/O power dissipation over VDDH. I/O power dissipation varies
widely by application due to buffer current, depending on external circuitry.
The VDDSYN power dissipation is negligible.
6 DC Characteristics
Table 6 provides the DC electrical characteristics for the MPC875/MPC870.
Table 6. DC Electrical Specifications
Characteristic
Symbol
Min
Operating voltage
Input high voltage (all inputs except EXTAL and EXTCLK)2
Input low voltage3
EXTAL, EXTCLK input high voltage
Input leakage current, Vin = 5.5 V (except TMS, TRST, DSCK, and
DSDI pins) for 5-V tolerant pins1
VDDH (I/O)
VDDL (core)
VDDSYN1
Difference
between VDDL
and VDDSYN
VIH
VIL
VIHC
Iin
Input leakage current, Vin = VDDH (except TMS, TRST, DSCK, and
DSDI)
IIn
Input leakage current, Vin = 0 V (except TMS, TRST, DSCK, and DSDI
pins)
Input capacitance4
IIn
Cin
3.135
1.7
1.7
—
2.0
GND
0.7 × VDDH
—
—
—
—
Max
3.465
1.9
1.9
100
3.465
0.8
VDDH
100
10
10
20
Unit
V
V
V
mV
V
V
V
µA
µA
µA
pF
MPC875/MPC870 PowerQUICC™ Hardware Specifications, Rev. 4
Freescale Semiconductor
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MPC870.PDF ] | |
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