KLM8G1GEAC-B001 Datasheet PDF - Samsung
| Part Number | KLM8G1GEAC-B001 | |
| Description | e.MMC | |
| Manufacturers | Samsung | |
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SAMSUNG CONFIDENTIAL
Rev. 1.0 Dec. 2012
KLMxGxGEAC-B001
Samsung e·MMC Product family
e.MMC 4.5 Specification compatibility
datasheet
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.
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KLMxGxGEAC-B001
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.0
e·MMC
INTRODUCTION
The SAMSUNG e·MMC is an embedded MMC solution designed in a BGA package form. e·MMC operation is identical to a MMC card and therefore is a
simple read and write to memory using MMC protocol v4.5 which is a industry standard.
e·MMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VDDF) whereas 1.8V or 3V dual supply voltage
(VDD) is supported for the MMC controller. Maximum MMC interface frequency of 200MHz and maximum bus widths of 8 bit are supported.
There are several advantages of using e·MMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to
faster product development as well as faster times to market.
The embedded flash mangement software or FTL(Flash Transition Layer) of e·MMC manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
1.0 PRODUCT LIST
[Table 1] Product List
Capacities e·MMC Part ID NAND Flash Type User Density (%)
Power System
Package size
Pin Configuration
8 GB
16 GB
32 GB
64 GB
KLM8G1GEAC-B001
KLMAG2GEAC-B001
KLMBG4GEAC-B001
KLMCG8GEAC-B001
64Gb x 1
64Gb x 2
64Gb x 4
64Gb x 8
91.0%
- Interface power : VDD
(1.70V ~ 1.95V or
2.7V ~ 3.6V)
- Memory power :
VDDF (2.7V ~ 3.6V)
11.5mm x 13mm x 1.0mm
11.5mm x 13mm x 1.2mm
153FBGA
2.0 KEY FEATURES
embeddedMultiMediaCard System Specification Ver. 4.5 compatible. Detail description is referenced by JEDEC Standard
SAMSUNG e·MMC supports new e·MMC4.5 features defined by JEDEC Standard
- Supported Features : Packed command, Cache, Discard, Sanitize, Power Off Notification, Data Tag,
Partition types, Context ID, Real Time Clock, Dynamic Device Capacity, HS200
- Non-supported Features : Large Sector Size (4KB)
Full backward compatibility with previous MultiMediaCard system specificataion (1bit data bus, multi-e·MMC systems)
Data bus width : 1bit (Default) , 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation(-25C ~ 85C), Storage without operation (-40C ~ 85C)
Power : Interface power → VDD (1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → VDDF(2.7V ~ 3.6V)
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
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Part DetailsOn this page, you can learn information such as the schematic, equivalent, pinout, replacement, circuit, and manual for KLM8G1GEAC-B001 electronic component. |
| Information | Total 30 Pages | |
| Link URL | [ Copy URL to Clipboard ] | |
| Product Image and Detail view |  1. - 8GB, NAND Flash Memory [ Learn More ] | |
| Download | [ KLM8G1GEAC-B001.PDF Datasheet ] | |
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