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PDF BTM7750G Data sheet ( Hoja de datos )
| Número de pieza | BTM7750G | |
| Descripción | TrilithIC | |
| Fabricantes | Infineon Technologies | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de BTM7750G (archivo pdf) en la parte inferior de esta página. Total 18 Páginas | ||
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Data Sheet, Rev. 1.0, June 2007
BTM7750G
TrilithIC
Automotive Power
1 page  
BTM7750G
Table 1 Pin Definitions and Functions
Pin No.
Symbol Function
1, 3, 25, 28 DL1
Drain of low-side switch1, lead frame 1 1)
2 IL1 Analog input of low-side switch1
4
N.C.
not connected
5, 10, 19, 24 DHVS Drain of high-side switches and power supply voltage, lead frame 2 1)
6 GND Ground
7 IH1 Digital input of high-side switch1
8 ST Status of high-side switches; open Drain output
9 IH2 Digital input of high-side switch2
11
N.C.
not connected
12, 14, 15, 18 DL2
Drain of low-side switch2, lead frame 3 1)
13 IL2 Analog input of low-side switch2
16,17
SL2 Source of low-side switch2
20,21
SH2 Source of high-side switch2
22,23
SH1 Source of high-side switch1
26,27
SL1 Source of low-side switch1
1) To reduce the thermal resistance these pins are direct connected via metal bridges to the lead frame.
Pins written in bold type need power wiring.
Data Sheet
5 Rev. 1.0, 2007-06-15
5 Page 
BTM7750G
5.2 Functional Range
Pos. Parameter
5.2.20 Supply voltage
5.2.21
5.2.22
5.2.23
5.2.24
Input voltage HS
Input voltage LS
Status output current
Junction temperature
Symbol Limit Values
min.
max.
VS VUVOFF 42
VIH
– 0.3
15
VIL
– 0.3
10
IST 0
2
Tj – 40 150
Unit
V
V
V
mA
°C
Remarks
After VS rising above
VUVON
–
–
–
–
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table
5.3 Thermal Resistance
Pos. Parameter
Symbol
Limit Values
Unit Conditions
Min. Typ. Max.
5.3.25 LS-junction to soldering point1)
RthJSP
–
–
20 K/W measured to pin 3 or 12
5.3.26 HS-junction to soldering point1)
RthJSP
–
–
20 K/W measured to pin 19
5.3.27 Junction to Ambient1)
RthJA = Tj(HS) / (P(HS)+ P(LS))
RthJA
–
36 –
K/W 2)
1) Not subject to production test, specified by design.
2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Data Sheet
11 Rev. 1.0, 2007-06-15
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet BTM7750G.PDF ] | |
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