|
|
Numéro de référence | EPC1001 | ||
Description | Enhancement Mode Power Transistor | ||
Fabricant | EPC | ||
Logo | |||
DATASHEET
EPC1001 – Enhancement Mode Power Transistor
VDSS , 100 V
RDS(ON) , 7 mW
ID , 25 A
EPC1001
EFFICIENT POWER CONVERSION
Gallium Nitride is grown on Silicon Wafers and processed using standard CMOS equipment leverag-
ing the infrastructure that has been developed over the last 55 years. GaN’s exceptionally high elec-
tron mobility and low temperature coefficient allows very low RDS(ON), while its lateral device structure
and majority carrier diode provide exceptionally low QG and zero QRR. The end result is a device that
can handle tasks where very high switching frequency, and low on-time are beneficial as well as
those where on-state losses dominate.
Maximum Ratings
VDS Drain-to-Source Voltage
ID
Continuous (TA = 25˚C,θJA = 20)
Pulsed (25˚C, Tpulse = 300 µs)
VGS
Gate-to-Source Voltage
Gate-to-Source Voltage
TJ Operating Temperature
TSTG Storage Temperature
100
25
100
6
-5
-40 to 125
-40 to 150
V
A
V
˚C
PARAMETER
Static Characteristics (TJ= 25˚C unless otherwise stated)
BVDSS
Drain-to-Source Voltage
IDSS Drain Source Leakage
IGSS
Gate-Source Forward Leakage
Gate-Source Reverse Leakage
VGS(th)
RDS(ON)
Gate Threshold Voltage
Drain-Source On Resistance
TEST CONDITIONS
VGS = 0 V, ID = 300 µA
VDS = 80 V, VGS = 0 V
VGS = 5 V
VGS = -5 V
VDS = VGS, ID = 5 mA
VGS = 5 V, ID = 25 A
Dynamic Characteristics (TJ= 25˚C unless otherwise stated)
CISS Input Capacitance
COSS Output Capacitance
CRSS Reverse Transfer Capacitance
QG Total Gate Charge (VGS = 5 V)
QGD Gate to Drain Charge
QGS Gate to Source Charge
QOSS Output Charge
QRR Source-Drain Recovery Charge
VDS = 50 V, VGS = 0 V
VDS = 50 V, ID = 25 A
Source-Drain Characteristics (TJ= 25˚C unless otherwise stated)
VSD
Source-Drain Forward Voltage
IS = 0.5 A, VGS = 0 V, T = 25˚C
IS = 0.5 A, VGS = 0 V, T = 125˚C
MIN
100
0.7
EPC – EFFICIENT POWER CONVERSION CORPORATION | WWW.EPC-CO.COM | COPYRIGHT 2011 |
EPC Power Transistors are supplied only in
passivated die form with solder bumps
Applications
• High Speed DC-DC conversion
• Class D Audio
• Hard Switched and High Frequency Circuits
Benefits
• Ultra High Efficiency
• Ultra Low RDS(on)
• Ultra low QG
• Ultra small footprint
TYP MAX UNIT
V
100 250 µA
1
0.2
5
1
mA
1.4 2.5 V
5.6 7 mΩ
800
450 pF
40
10.5
3.3
3 nC
32
0
1.8
1.75
V
| PAGE 1
|
|||
Pages | Pages 4 | ||
Télécharger | [ EPC1001 ] |
No | Description détaillée | Fabricant |
EPC1001 | Enhancement Mode Power Transistor | EPC |
EPC1005 | Enhancement Mode Power Transistor | EPC |
EPC1007H | Ethernet DC/DC Converter | PCA Electronics |
EPC1007P | Ethernet DC/DC Converter | PCA Electronics |
US18650VTC5A | Lithium-Ion Battery | Sony |
TSPC106 | PCI Bus Bridge Memory Controller | ATMEL |
TP9380 | NPN SILICON RF POWER TRANSISTOR | Advanced Semiconductor |
www.DataSheetWiki.com | 2020 | Contactez-nous | Recherche |