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PDF LV8702V Data sheet ( Hoja de datos )

Número de pieza LV8702V
Descripción PWM Current Control High-efficient Stepper Motor Driver
Fabricantes ON Semiconductor 
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No Preview Available ! LV8702V Hoja de datos, Descripción, Manual

LV8702V
Bi-CDMOS LSI
PWM Current Control High-efficient
Stepper Motor Driver
www.onsemi.com
Overview
The LV8702V is a 2-channel Full-bridge driver IC that can drive a stepper
motor driver, which is capable of micro-step drive and supports quarter
step. Current is controlled according to motor load and rotational speed at
half step, half step full-torque and quarter step excitation, thereby highly
efficient drive is realized. Consequently, the reduction of power
consumption, heat generation, vibration and noise is achieved.
Feature
Built-in 1ch PWM current control stepper motor driver (bipolar type)
SSOP44J (275mil)
Ron (High-side Ron: 0.3, Low-side Ron: 0.25, total: 0.55, Ta = 25ºC, IO = 2.5A)
Micro-step mode is configurable as follows: full step/half step full-torque/half step/quarter step
Excitation step moves forward only with step signal input
Built-in output short protection circuit (latch method)
Control power supply is unnecessary
Built-in high-efficient drive function (supports half step full-torque/half step/quarter step excitation mode)
Built-in step-out detection function (Step-out detection may not be accurate during high speed rotation)
BiCDMOS process IC
IO max=2.5A
Built-in thermal shut down circuit
Typical Applications
Printer
Scanner
Surveillance camera (CCTV)
Textile machine
ORDERING INFORMATION
See detailed ordering and shipping information on page 27 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
December 2014 - Rev. 2
1
Publication Order Number :
LV8702V/D

1 page




LV8702V pdf
LV8702V
SOLDERING FOOTPRINT*
(Unit: mm)
(7.8)
0.65 0.32
NOTES:
1. The measurements are for reference only, and unable to guarantee.
2. Please take appropriate action to design the actual Exposed Die Pad and Fin portion.
3. After setting, verification on the product must be done.
(Although there are no recommended design for Exposed Die Pad and Fin portion Metal mask and shape
for ThroughHole pitch (Pitch & Via etc), checking the soldered joint condition and reliability verification of
soldered joint will be needed. Void gradient insufficient thickness of soldered joint or bond degradation
could lead IC destruction because thermal conduction to substrate becomes poor.)
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
GENERIC
MARKING DIAGRAM*
XXXXXXXXXX
YMDDD
XXXXX = Specific Device Code
Y = Year
M = Month
DDD = Additional Traceability Data
Pd max -- Ta
6.0
Four-layer circuit board *1
5.5
5.0
4.0
Four-layer circuit board *2
3.8
3.0
2.0
2.9
2.0
1.0
*1 With components mounted on the exposed die-pad board
0 *2 With no components mounted on the exposed die-pad board
--40 --20 0 20 40 60 80
Ambient temperature, Ta -- C
100
www.onsemi.com
5

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LV8702V arduino
Continued from preceding page.
Pin No.
Pin name
2 CP2
3 CP1
43 VG
44 VM
VREG5
LV8702V
Equivalent Circuit
3 44
2
100
43
21 VREF
GND
VREG5
14 VREG5
15 DST2
16 DST1
17 MONI
19 SST
500
GND
VM
GND
VREG5
2k
80k
26k
100k
GND
www.onsemi.com
11
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