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PDF LV8747TA Data sheet ( Hoja de datos )
| Número de pieza | LV8747TA | |
| Descripción | PWM Constant-Current Control Stepping Motor Driver and Switching Regulator Controller | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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Ordering number : ENA2019
LV8747TA
Bi-CMOS LSI
PWM Constant-Current Control Stepping Motor
Driver and Switching Regulator Controller
http://onsemi.com
Overview
The LV8747TA is a PWM constant-current control stepping motor driver and switching regulator controller IC.
Features
• Two circuits of PWM constant-current control stepping motor driver incorporated
• Control of the stepping motor to W1-2 phase excitation possible
• Output-stage push-pull composition enabling high-speed operation
• Two circuits of switching regulator controller incorporated • Thermal shutdown circuit incorporated
• Timer latch type short-circuit protection circuit incorporated • Motor driver control power incorporated
• Output short-circuit protection circuit incorporated
• Chopping frequency selectable
• High-precision reference voltage circuit incorporated
• Upper and lower regenerative diodes incorporated
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Symbol
Conditions
Ratings
Unit
Supply voltage
VM max
38 V
Driver output peak current 1
Driver output continuous current 1
Driver output peak current 2
Driver output continuous current 2
Regulator output current
Allowable power dissipation 1
MDIO peak1
MDIO max1
MDIO peak2
MDIO max2
SWIO max
Pd max1
OUT1/OUT2 tw ≤ 10ms, duty 20%
OUT1/OUT2
OUT3/OUT4 tw ≤ 10ms, duty 20%
OUT3/OUT4
OUT5/OUT6 tw ≤ 1μs
Independent IC
1.75 A
1.5 A
0.8 A
0.5 A
500 mA
0.4 W
Allowable power dissipation 2
Pd max2
Our recommended four-layer substrate *1, *2
4.85
W
Operating temperature
Topr
-20 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
*1 Specified circuit board : 100×100×1.6mm3 : 4-layer glass epoxy printed circuit board
*2 For mounting to the backside by soldering, see the precautions.
Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current,
high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Semiconductor Components Industries, LLC, 2013
June, 2013
41112 SY 20120131-S00006 No.A2019-1/20
1 page  
LV8747TA
Pd max – Ta
6.0
*1 With Exposed Die-Pad substrate
*2 Without Exposed Die-Pad
Four-layer substrate *1
4.85
4.0
Four-layer substrate *2
2.40
2.0
2.52
1.25
0
– 20 0
20 40 60 80 100
Ambient temperature, Ta – °C
Substrate Specifications (Substrate recommended for operation of LV8747TA)
Size : 100mm × 100mm × 1.6mm (four-layer substrate [2S2P])
Material
: Glass epoxy
Copper wiring density : L1 = 85% / L4 = 90%
L1 : Copper wiring pattern diagram
L4 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 80% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A2019-5/20
5 Page 
Continued from preceding page.
Pin No.
Pin Name
49 FB6
50 INV6
51 NON6
52 FB5
53 INV5
54 NON5
48 DT6
46 CT
47 RT
57 OUT6
58 OUT5
LV8747TA
REG5
VMSW
50 53
500Ω
Equivalent Circuit
VMSW
2kΩ
2kΩ
500Ω
GND
VMSW
REG5
VMSW
51
54
500Ω
49
52
REG5
GND
GND
VMSW
46
VMSW
500Ω
500Ω
500Ω
47
REGVM5
Continued on next page.
No.A2019-11/20
11 Page | ||
| Páginas | Total 20 Páginas | |
| PDF Descargar | [ Datasheet LV8747TA.PDF ] | |
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