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What is NTLUS3A39PZC?

This electronic component, produced by the manufacturer "ON Semiconductor", performs the same function as "Power MOSFET ( Transistor )".


NTLUS3A39PZC Datasheet PDF - ON Semiconductor

Part Number NTLUS3A39PZC
Description Power MOSFET ( Transistor )
Manufacturers ON Semiconductor 
Logo ON Semiconductor Logo 


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NTLUS3A39PZC
Power MOSFET
20 V, 5.2 A, Single PChannel, ESD,
1.6x1.6x0.55 mm UDFN mCoolt Package
Features
UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
Low Profile UDFN 1.6 x 1.6 x 0.55 mm for Board Space Saving
Ultra Low RDS(on)
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Applications
Optimized for Power Management Applications for Portable
Products, Such as Cell Phones, PMP, Media Tablets, DSC, GPS, and
Others
Battery Switch
High Side Load Switch
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value
Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current (Note 1)
Continuous Drain
Current (Note 1)
Steady
State
t5s
Power Dissipa-
tion (Note 1)
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
VDSS
VGS
ID
PD
20
±8.0
5.2
3.7
6.4
1.5
V
V
A
W
Continuous Drain
Current (Note 2)
t5s
Steady
State
TA = 25°C
TA = 25°C
TA = 85°C
ID
2.3
3.4 A
2.4
Power Dissipation (Note 2)
TA = 25°C
PD
0.6 W
Pulsed Drain Current
tp = 10 ms
IDM
17 A
Operating Junction and Storage
Temperature
TJ,
TSTG
-55 to
150
°C
Source Current (Body Diode) (Note 2)
IS 1 A
Lead Temperature for Soldering Purposes TL 260 °C
(1/8from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm2, 2 oz. Cu.
© Semiconductor Components Industries, LLC, 2013
May, 2013 Rev. 0
1
http://onsemi.com
V(BR)DSS
20 V
MOSFET
RDS(on) MAX
39 mW @ 4.5 V
50 mW @ 2.5 V
81 mW @ 1.8 V
147 mW @ 1.5 V
ID MAX
5.2 A
S
G
D
PChannel MOSFET
MARKING DIAGRAM
1
6
UDFN6
(mCOOL])
CASE 517AU
1
AF MG
G
AF = Specific Device Code
M = Date Code
G = PbFree Package
(*Note: Microdot may be in either location)
PIN CONNECTIONS
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Publication Order Number:
NTLUS3A39PZC/D

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NTLUS3A39PZC equivalent
NTLUS3A39PZC
TYPICAL CHARACTERISTICS
90
80 RqJA = 85°C/W
70
60
50 Duty Cycle = 0.5
40
30
20 0.2
10 0.1
0.05 0.02 0.01
0
1E06
1E05
1E04
Single Pulse
1E03
1E02
1E01
t, TIME (s)
1E+00
Figure 13. FET Thermal Response
1E+01
1E+02
1E+03
DEVICE ORDERING INFORMATION
Device
Package
Shipping
NTLUS3A39PZCTAG
UDFN6
(PbFree)
3000 / Tape & Reel
NTLUS3A39PZCTBG
UDFN6
(PbFree)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
http://onsemi.com
5


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Part NumberDescriptionMFRS
NTLUS3A39PZThe function is Power MOSFET ( Transistor ). ON SemiconductorON Semiconductor
NTLUS3A39PZCThe function is Power MOSFET ( Transistor ). ON SemiconductorON Semiconductor

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