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FDZ4670S fiches techniques PDF

Fairchild Semiconductor - N-Channel PowerTrench SyncFET

Numéro de référence FDZ4670S
Description N-Channel PowerTrench SyncFET
Fabricant Fairchild Semiconductor 
Logo Fairchild Semiconductor 





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FDZ4670S fiche technique
March 2008
FDZ4670S
N-Channel PowerTrench® SyncFET TM
30V, 25A, 2.4m
tm
Features
„ Max rDS(on) = 2.4mat VGS = 10V, ID = 25A
„ Max rDS(on) = 4.0mat VGS = 4.5V, ID = 19A
„ Ultra-thin package: less than 0.85mm height when mounted to
PCB
„ Outstanding thermal transfer characteristics
„ Ultra-low gate charge x rDS(on) product
„ RoHS Compliant
General Description
Combining Fairchild's 30V PowerTrench® process with
state-of-the-art BGA packaging, the FDZ4670S minimizes both
PCB space and rDS(on). This BGA MOSFET embodies a
breakthrough in packaging technology which enables the device
to combine excellent thermal transfer characteristics, high
current handling capacity, ultra-low profile packaging, low gate
charge and low rDS(on) incorporating SyncFET technology. This
device has the added benefit of an efficient monolithic Schottky
body diode to reduce Trr and diode forward voltage.
This MOSFET feature faster switching and lower gate charge
than other MOSFETs with comparable rDS(on) specifications
resulting in DC/DC power supply designs and POL converters
with higher overall efficiency.
Applications
„ DC - DC Conversion
„ POL converters
Index slot
D
G
Bottom
FLFBGA 3.5X4.0
Top
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
VGS
ID
PD
TJ, TSTG
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current -Continuous
-Pulsed
TA = 25°C
Power Dissipation
TA = 25°C
Power Dissipation
TA = 25°C
Operating and Storage Junction Temperature Range
Thermal Characteristics
(Note 1a)
(Note 1a)
(Note 1b)
S
Ratings
30
±20
25
107
2.5
1.25
-55 to +150
Units
V
V
A
W
°C
RθJC
RθJA
RθJA
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Package Marking and Ordering Information
(Note 1a)
(Note 1b)
0.85
50
100
°C/W
Device Marking
4670S
Device
FDZ4670S
Package
FLFBGA 3.5X4.0
Reel Size
13’’
Tape Width
12mm
Quantity
3000 units
©2008 Fairchild Semiconductor Corporation
FDZ4670S Rev.B1
1
www.fairchildsemi.com

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