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ESD5B5.0S fiches techniques PDF

ON Semiconductor - Transient Voltage Suppressor

Numéro de référence ESD5B5.0S
Description Transient Voltage Suppressor
Fabricant ON Semiconductor 
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ESD5B5.0S fiche technique
ESD5B5.0S, SZESD5B5.0S
Transient Voltage Suppressor
Micro−Packaged Diode for ESD Protection
The ESD5B Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size and bi−directional
design, it is ideal for use in cellular phones, MP3 players, and portable
applications that require audio line protection.
Specification Features
Low Capacitance 32 pF
Low Clamping Voltage
Small Body Outline Dimensions: nom 0.063x 0.032(1.6x0.8 mm)
Low Body Height: nom 0.024(0.6 mm)
Reverse Working (Stand−off) Voltage: 5.0 V
Peak Power up to 50 W @ 8 x 20 ms Pulse
Low Leakage
Response Time is Typically < 1 ns
ESD Rating of Class 3 (> 16 kV) per Human Body Model
IEC61000−4−2 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
This is a Pb−Free Device
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
www.onsemi.com
2
1
SOD−523
CASE 502
MARKING DIAGRAM
B5 G
1G
2
B5 = Specific Device Code
M Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
MAXIMUM RATINGS
Device
Package
Shipping
Rating
IEC 61000−4−2 (ESD)
Symbol
Contact
Air
Value
±30
±30
Unit
kV
ESD Voltage
Per Human Body Model
Per Machine Model
16 kV
400 V
Peak Power (Figure 1) Per 8 x 20 ms Waveform
Peak Power (Figure 2)Per 10 x 1000 ms Waveform
PPK
Total Power Dissipation on FR−5 Board (Note 1)
@ TA = 25°C
°PD°
Junction and Storage Temperature Range
TJ, Tstg
50
10
200
−55 to
+150
W
mW
°C
ESD5B5.0ST1G
SOD−523 3000 / Tape &
(Pb−Free)
Reel
ESD5B5.0ST5G
SOD−523 8000 / Tape &
(Pb−Free)
Reel
SZESD5B5.0ST1G SOD−523 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Lead Solder Temperature − Maximum
(10 Second Duration)
TL 260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 5
1
Publication Order Number:
ESD5B5.0ST1/D

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