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PDF NCP81074B Data sheet ( Hoja de datos )
| Número de pieza | NCP81074B | |
| Descripción | Single Channel 10A High Speed Low-Side MOSFET Driver | |
| Fabricantes | ON Semiconductor | |
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NCP81074A, NCP81074B
Single Channel 10A High
Speed Low-Side MOSFET
Driver
The NCP81074 is a single channel, low−side MOSFET driver. It is
capable of providing large peak currents into capacitive loads. This
driver can deliver a 7 A peak current at the Miller plateau region to
help reduce the Miller effect during MOSFETs switching transitions.
It exhibits a split output configuration allowing the user to control the
turn on and turn off slew rates. This part is available in SOIC−8 and
DFN8 2x2 mm packages.
Features
• High Current Drive Capability ±10 A
• TTL/CMOS Compatible Inputs Independent of Supply Voltage
• High Reverse Current Capability (10 A) Peak
• 4 ns Typical Rise and 4 ns Typical Fall Times with 1.8 nF Load
• Fast Propagation Delay Times of 15 ns with Input Falling and 15 ns
with Input Rising
• Input Voltage Range from 4.5 V to 20 V
• Split Output Configuration
• Dual Input Design Offering Drive Flexibility
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Server Power
• Telecommunication, Datacenter Power
• Synchronous Rectifier
• Switch Mode Power Supply
• DC/DC Converter
• Power Factor Correction
• Motor Drive
• Renewable Energy, Solar Inverter
www.onsemi.com
MARKING
DIAGRAMS
DFN8
MN SUFFIX
CASE 506AA
1
XXMG
G
1
XX = Specific Device Code
M = Date Code
G = Pb−Free Device
(Note: Microdot may be in either location)
8
1
SOIC−8
CASE 751
8
XXXXXX
AYWW
G
1
XXXXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 3
1
Publication Order Number:
NCP81074/D
1 page  
NCP81074A, NCP81074B
Table 2. ELECTRICAL CHARACTERISTICS (Note 1) (Typical values: VDD =12V, 1uF from VDD to GND,TA = TJ =
−405C to 1405C, typical at TAMB = 255C, unless otherwise specified)
Parameter
SYMBOL
Test Conditions
MIN TYP MAX Unit
SWITCHING CHARACTERISTICS
Propagation Delay Time Low to High, IN
Rising (IN to OUT) (Note 2)
td1
CLoad = 1.8 nF
15 27 ns
Propagation Delay Time High to Low, IN
Falling (IN to OUT) (Note 2)
td2
CLoad = 1.8 nF
15 27 ns
Rise Time (Note 2)
tr CLoad = 1.8 nF
4 7 ns
Fall Time (Note 2)
tf CLoad = 1.8 nF
4 7 ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. All Limits are 100% tested at TAMB = 25 °C and guaranteed across temperature by design and statistical analysis.
2. Guaranteed by characterization. *See timing Waveforms.
Table 3. LOGIC TRUTH TABLE
IN+ IN−
LL
LH
HL
HH
OUTH
HIGH−Z
HIGH−Z
H
HIGH−Z
OUTL
L
L
HIGH−Z
L
OUT
(OUTH & OUTL CONNECTED
TOGETHER)
L
L
H
L
Figure 3. Non−inverting Input Driver Operation
Figure 4. Inverting Input Driver Operation
www.onsemi.com
5
5 Page 
NCP81074A, NCP81074B
PACKAGE DIMENSIONS
DFN8 2x2
CASE 506AA
ISSUE E
DA
B
PIN ONE
REFERENCE
ÇÇÇÇ2X 0.15 C
E
2X 0.15 C TOP VIEW
0.10 C
DETAIL B
A
0.08 C
NOTE 4
(A3)
A1
SIDE VIEW
C
DETAIL A
D2
14
8X L
LL
L1
DETAIL A
OPTIONAL
CONSTRUCTIONS
ÉÉÉÉEXPOSED Cu
MOLD CMPD
DETAIL B
OPTIONAL
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.20 0.30
D 2.00 BSC
D2 1.10 1.30
E 2.00 BSC
E2 0.70 0.90
e 0.50 BSC
K 0.30 REF
L 0.25 0.35
L1 −−− 0.10
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
1.30
8X
0.50
E2
K8
e/2
e
5
8X b
0.10 C A B
0.05 C NOTE 3
BOTTOM VIEW
0.90 2.30
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet NCP81074B.PDF ] | |
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