NTND31200PZ Datasheet PDF - ON Semiconductor
| Part Number | NTND31200PZ | |
| Description | Small Signal MOSFET | |
| Manufacturers | ON Semiconductor | |
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NTND31200PZ
Small Signal MOSFET
−20 V, −127 mA, Dual P−Channel,
0.65 mm x 0.90 mm x 0.4 mm XLLGA6
Package
Features
• Dual P−Channel MOSFET
• Offers a Low RDS(ON) Solution in the Ultra Small
0.65 mm × 0.90 mm Package
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Small Signal Load Switch
• Analog Switch
• High Speed Interfacing
• Optimized for Power Management in Ultra Portable Products
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
Gate-to-Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
Power Dissipation
(Note 1)
t≤5s
Steady
State
TA = 25°C
TA = 85°C
TA = 25°C
TA = 25°C
VDSS
VGS
ID
PD
−20
±8
−127
−91
−146
125
V
V
mA
mW
t≤5s
166
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
IDM
TJ,
TSTG
IS
TL
−488
−55 to
150
−200
260
mA
°C
mA
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface-mounted on FR4 board using the minimum recommended pad size,
1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%
www.onsemi.com
V(BR)DSS
−20 V
RDS(ON) MAX
5.0 W @ −4.5 V
6.0 W @ −2.5 V
7.0 W @ −1.8 V
10.0 W @ −1.5 V
ID Max
−127 mA
P−Channel MOSFET
S1
S2
G1 G2
D1 D2
XLLGA6
Case 713AC
PINOUT DIAGRAM
6 D1
S1 1
5 G2
G1 2
4 S2
D2 3
(Bottom View)
MARKING DIAGRAM
EM
1
E = Specific Device Code
M = Date Code
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2015
November, 2015 − Rev. 0
1
Publication Order Number:
NTND31200PZ/D
|
| |
 
NTND31200PZ
PACKAGE DIMENSIONS
D
PIN ONE
REFERENCE
ÇÇÇÇ2X 0.05 C
2X 0.05 C
TOP VIEW
AB
E
0.05 C
A
XLLGA6 0.90x0.65
CASE 713AC
ISSUE O
0.05 C
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. POSITIONAL TOERANCE APPLIES TO ALL
SIX LEADS.
MILLIMETERS
DIM MIN MAX
A 0.340 0.440
A1 0.000 0.050
b 0.200 0.300
b2 0.080 0.180
D 0.900 BSC
E 0.650 BSC
e 0.295 BSC
e1 0.340 BSC
e2 0.300 BSC
e3 0.208 BSC
e4 0.158 BSC
L 0.215 0.315
L2 0.115 0.215
e2
12
e1
e
3 e4
4X L2
e3
2X L
2X b
6
54
4X b2
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.300
0.345
PITCH
0.300
PITCH
4X
0.300
2X
0.400
1
0.781
4X 0.180
0.340
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
www.onsemi.com
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