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What is Si3066?

This electronic component, produced by the manufacturer "Silicon Laboratories", performs the same function as "V.32 FCC+ EMBEDDED DIRECT ACCESS ARRANGEMENT".


Si3066 Datasheet PDF - Silicon Laboratories

Part Number Si3066
Description V.32 FCC+ EMBEDDED DIRECT ACCESS ARRANGEMENT
Manufacturers Silicon Laboratories 
Logo Silicon Laboratories Logo 


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Si3066
V. 3 2 F C C + E M B E D D E D D I R E C T A C C E S S A R R A N G E M E N T
Features
„ Supports up to V.32 modem
speeds
„ Patented >6000 V isolation
technology
„ Compliant with 49 PTTs,
„ Proprietary isolation capacitor
including FCC, JATE, China, and interface to integrated DAA module
Korea
„ Line voltage monitor
„ Integrated analog front end
(AFE) and 2- to 4-wire hybrid
„ Integrated ring detector
„ Pulse dialing support
„ Loop current monitor
„ Caller ID support
„ Lead-free and RoHS-compliant
8-pin ESOIC package
Applications
„ V.32 modems
„ Digital televisions
Description
„ Set-top boxes
„ Fax machines
„ ePOS terminals
„ Multi-function
printers
„ Vending machines
The Si3066 is an integrated direct access arrangement (DAA) for use with
an integrated DAA system-side module. It includes a V.32 quality codec, dc
termination, ac termination, and an integrated hybrid, eliminating the need
for an analog front end (AFE), isolation transformer, relays, optoisolator,
and a 2- to 4-wire hybrid. It interfaces directly to the integrated system-side
module and features Silicon Laboratories’ patented isolation technology.
The Si3066 dramatically reduces the board space, component count, and
cost required to implement a DAA compliant with the regulatory
requirements of 49 different PTTs including FCC, JATE, China, and Korea.
Ordering Information
See page 36.
Pin Assignments
Si3066
C1B
C2B
VREG
CID
Si3066
1 98
2
3
IGND
7
6
45
RX
DCT
QB
QE
US Patent # 5,870,046
US Patent # 6,061,009
Other Patents Pending
Functional Block Diagram
Si3066
Silicon
Laboratories
Embedded
System-side
DAA Module
C1B
C2B
Isolation
Interface
Hybrid and
dc
Termination
Ring Detect
Off-Hook
RX
DCT
VREG
IGND
CID
QB
QE
TIP
RING
Rev. 1.0 9/05
Copyright © 2005 by Silicon Laboratories
Si3066

line_dark_gray
Si3066 equivalent
Si3066
Table 3. DAA AC Characteristics
(TA = 0 to 70 °C, Fs = 8 kHz)
Parameter
Symbol
Test Condition
Min Typ Max Unit
Sample Rate
Fs
7.2 — 16 kHz
Receive Frequency Response
Low –3 dBFS Corner
—5—
Hz
Transmit Full Scale Level1
Receive Full Scale Level1,2
VFS
VFS
–1 dBm
–1 dBm
— 0.98 —
— 0.98 —
VPEAK
VPEAK
Dynamic Range3,4,5
DR
IL = 100 mA
— 70 —
dB
Dynamic Range3,4,5
DR
IL = 20 mA
— 70 —
dB
Transmit Total Harmonic Distortion5,6 THD
IL = 20 mA
— 65 —
dB
Receive Total Harmonic Distortion5,6 THD
IL = 20 mA
— 68 —
dB
Dynamic Range (caller ID mode)7
DRCID
VIN = 1 kHz, –13 dBm
— 50 —
dB
Caller ID Full Scale Level
VCID
—6—
VPP
Notes:
1. Measured at TIP and RING with 600 . termination at 1 kHz, as shown in Figure 1.
2. Receive full scale level produces –0.9 dBFS.
3. DR = 20 x log (rms VFS/rms VIN)+ 20 x log (rms VIN/rms noise, excluding harmonics). VFS is the –1 dBm full-scale
level.
4. Measurement is 300 to 3400 Hz. Applies to both transmit and receive paths.
5. VIN = 1 kHz, –3 dBFS
6. THD = 20 x log (rms distortion / rms signal).
7. DRCID = 20 x log (rms VCID/rms VIN)+ 20 x log (rms VIN/rms noise). VCID is the 6 V full-scale level.
Rev. 1.0
5


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