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PDF PUSB3F96 Data sheet ( Hoja de datos )
| Número de pieza | PUSB3F96 | |
| Descripción | ESD protection | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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PUSB3F96
ESD protection for ultra high-speed interfaces
Rev. 3 — 29 September 2014
Product data sheet
1. Product profile
1.1 General description
The device is designed to protect high-speed interfaces such as SuperSpeed USB,
High-Definition Multimedia Interface (HDMI), DisplayPort, external Serial Advanced
Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces
against ElectroStatic Discharge (ESD).
The device includes four high-level ESD protection diode structures for ultra high-speed
signal lines and is encapsulated in a leadless small DFN2510A-10 (SOT1176-1) plastic
package.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.5 pF. These diodes utilize a unique snap-back structure in order to
provide protection to downstream components from ESD voltages up to 10 kV contact
exceeding IEC 61000-4-2, level 4.
1.2 Features and benefits
System ESD protection for USB 2.0 and SuperSpeed USB 3.0, HDMI 2.0, DisplayPort,
eSATA and LVDS
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of 10 kV exceeding IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Signal lines with 0.05 pF matching capacitance between signal pairs
Line capacitance of only 0.5 pF for each channel
Design-friendly ‘pass-through’ signal routing
1.3 Applications
The device is designed for high-speed receiver and transmitter port protection:
TVs and monitors
DVD recorders and players
Notebooks, main board graphic cards and ports
Set-top boxes and game consoles
1 page  
NXP Semiconductors
PUSB3F96
ESD protection for ultra high-speed interfaces
aaa-014157
Fig 5.
Data rate: 5 Gbit/s
Vertical scale: 166.3 mV/div
Horizontal scale: 20 ps/div
USB 3.0 eye diagram, Printed-Circuit Board (PCB) with PUSB3F96
Fig 6.
Data rate: 5 Gbit/s
Vertical scale: 166.3 mV/div
Horizontal scale: 20 ps/div
USB 3.0 eye diagram, PCB without PUSB3F96 (reference)
aaa-014158
PUSB3F96
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
5 of 15
5 Page 
NXP Semiconductors
9. Soldering
PUSB3F96
ESD protection for ultra high-speed interfaces
Footprint information for reflow soldering of DFN2510A-10 package
SOT1176-1
Hx
Hy Ay By
C
0.05
D P 0.05
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
P Ay By
C
0.5 1.25 0.3 0.475
D
0.2
Hx
2.45
Hy
1.5
Remark:
Stencil of 75 μm is recommended.
A stencil of 75 μm gives an aspect ratio of 0.77
With a stencil of 100 μm one will obtain an aspect ratio of 0.58
Fig 17. Reflow soldering footprint DFN2510A-10 (SOT1176-1)
sot1176-1_fr
PUSB3F96
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 29 September 2014
© NXP Semiconductors N.V. 2014. All rights reserved.
11 of 15
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| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet PUSB3F96.PDF ] | |
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