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PDF BTA2008W-800D Data sheet ( Hoja de datos )
| Número de pieza | BTA2008W-800D | |
| Descripción | 3Q Hi-Com Triac | |
| Fabricantes | NXP Semiconductors | |
| Logotipo |  |
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BTA2008W-800D
3Q Hi-Com Triac
14 August 2014
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT223 surface mountable
plastic package. This "series D" triac balances the requirements of commutation
performance and gate sensitivity and is intended for interfacing with low power drivers
and logic ICs including microcontrollers.
2. Features and benefits
• 3Q technology for improved noise immunity
• Direct gate triggering from low power drivers and logic ICs
• High commutation capability with very sensitive gate
• High voltage capability
• Planar passivated for voltage ruggedness and reliability
• Surface mountable package
• Triggering in three quadrants only
• Very sensitive gate for easy logic level triggering
3. Applications
• Low power motor controls
• Small inductive loads e.g. solenoids, door locks, water valves
• Small loads in large white goods
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
Conditions
VDRM
repetitive peak off-
state voltage
ITSM non-repetitive peak on- full sine wave; Tj(init) = 25 °C;
state current
tp = 20 ms; Fig. 4; Fig. 5
Tj junction temperature
IT(RMS)
RMS on-state current full sine wave; Tsp ≤ 111 °C; Fig. 1;
Fig. 2; Fig. 3
Static characteristics
IGT
gate trigger current
VD = 12 V; IT = 0.1 A; T2+ G+;
Tj = 25 °C; Fig. 9
Min Typ Max Unit
- - 800 V
- - 9A
- - 125 °C
- - 0.8 A
0.25 -
5 mA
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1 page  
NXP Semiconductors
103
ITSM
(A)
102
(1)
10
BTA2008W-800D
3Q Hi-Com Triac
003aag394
IT ITSM
t
tp
Tj(init) = 25 °C max
1
10-5
10-4
10-3
10-2
tp (s)
tp ≤ 20 ms; (1) dIT/dt limit
Fig. 5. Non-repetitive peak on-state current as a function of pulse duration; maximum values
10-1
BTA2008W-800D
Product data sheet
All information provided in this document is subject to legal disclaimers.
14 August 2014
© NXP Semiconductors N.V. 2014. All rights reserved
5 / 15
5 Page 
NXP Semiconductors
10. Package outline
Plastic surface-mounted package with increased heatsink; 4 leads
BTA2008W-800D
3Q Hi-Com Triac
SOT223
DB
E AX
y
b1
4
c
HE
vM A
1 23
e1 bp
e
wM B
A1
Q
A
detail X
Lp
0 2 4 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y
mm
1.8 0.10 0.80 3.1 0.32 6.7
1.5 0.01 0.60 2.9 0.22 6.3
3.7
3.3
4.6
2.3
7.3
6.7
1.1 0.95
0.7 0.85
0.2
0.1
0.1
OUTLINE
VERSION
SOT223
IEC
REFERENCES
JEDEC
JEITA
SC-73
Fig. 14. Package outline SC-73 (SOT223)
BTA2008W-800D
All information provided in this document is subject to legal disclaimers.
Product data sheet
14 August 2014
EUROPEAN
PROJECTION
ISSUE DATE
04-11-10
06-03-16
© NXP Semiconductors N.V. 2014. All rights reserved
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| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet BTA2008W-800D.PDF ] | |
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