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PDF RClamp3324P Data sheet ( Hoja de datos )
| Número de pieza | RClamp3324P | |
| Descripción | 4-Line Surge and ESD Protection | |
| Fabricantes | Semtech | |
| Logotipo |  |
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RClamp3324P
Low Capacitance RailClamp®
4-Line Surge and ESD Protection
PROTECTION PRODUCTS
Description
RailClamp® 3324P provides ESD protection for high-
speed data interfaces. It features a high maximum ESD
withstand voltage of ±17kV contact and ±20kV air
discharge per IEC 61000-4-2. RClamp3324P is designed
to minimize both the ESD peak clamping and the TLP
clamping. Package inductance is reduced at each pin
resulting in lower peak ESD clamping voltage. The
dynamic resistance is among the industry’s lowest at
0.15 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF allowing the RClamp3324P to
be used in applications operating in excess of 5GHz
without signal attenuation. Each device will protect up
to four lines (two high-speed pairs) and are qualified
to AEC-Q100, Grade 1 (-40 to +125 oC) for automotive
applications. .
RClamp3324P is in a 10-pin SGP2510P8 package
measuring 2.5 x 1.0mm with a nominal height of
0.60mm. The leads have a nominal pin-to-pin pitch of
0.50mm. Flow- through package design simplifies PCB
layout and maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low
dynamic resistance, and innovative package design
enables this device to provide the highest level of ESD
protection for applications such as USB 3.0, eSATA, and
DisplayPort.
Nominal Dimension
Features
• Transient Protection to
IEC 61000-4-2 (ESD) 20kV (Air), 17kV (Contact)
IEC 61000-4-4 (EFT) 4kV (5/50ns)
IEC 61000-4-5 (Lightning) 4.5A (8/20µs)
ISO-10605 (ESD) 15kV (Air), 12kV (Contact)
• Qualified to AEC-Q100, Grade 1
• Package design optimized for high speed layout
• Protects four high-speed data lines
• Working Voltage: 3.3V
• Low Capacitance: 0.65 pF maximum (I/O to GND)
• Dynamic Resistance: 0.15 Ohms (Typ)
• Solid-State Silicon-Avalanche Technology
Mechanical Characteristics
• SGP2510P8 Package
• Pb-Free, Halogen Free, RoHS/WEEE Compliant
• Nominal Dimensions: 2.5 x 1.0 x 0.60 mm
• Lead Finish: NiPdAu
• Molding Compound Flammability Rating: UL 94V-0
• Marking : Marking Code + Date Code
• Packaging : Tape and Reel
Applications
• USB 3.0
• Automotive Applications
• Industrial Equipment
• Digital Visual Interface
• LVDS Interfaces
• eSATA
Functional Schematic
2.50
12
1.00
0.50 BSC
0.60
RClamp3324P
Final Datasheet
Revision date
Nominal Dimensions in mm
Rev 6
June 9, 2015
www.semtech.com
Device Schematic
1 of 8
Semtech
1 page  
Application Information
USB Interface Protection
For USB 3.0 applications, RClamp3324P is recommended
for protecting the 5Gb/s SuperSpeed line pairs. Fig-
ure 1 below shows an example of protecting a USB 3.0
Type-A interfaces (host side shown). Lines are routed
through each device entering at pins 1, 2, 4, and 5 and
exiting at pins 10, 9, 7, and 6 respectively (Figure 2). Each
trace should run under the device and connect the pins
together. Ground connection is made at the center tabs
(pins 3, and 8 ). Traces should be kept the same length
to avoid impedance mismatch. The differential imped-
ance of each pair can be controlled for USB 3.0 (85 Ohms
+/-15%) while maintaining a minimum trace-to-trace and
trace-to-pad spacing. Individual PCB design constraints
may necessitate different spacing or trace width. Both
ground pads should be connected for optimal perfor-
mance. Ground connection is made using filled via-in-
pad.
RClamp0512TQ is be used to protect D+ and D- lines.
These lines are routed through RClamp0512TQ at pin1
and pin 2. Pin 3 is connected to the ground plane.
RClamp0512TQ is qualified to AEC-Q100. Additional
information may be found on the device data sheet.
Single line devices such as uClamp0571P are recom-
mended for surge and ESD protection of the VBus line.
This device features high surge and ESD capability and
may be used on 5V power rails. In power delivery (PD)
applications, higher working voltage TVS device may be
needed. Options exist for ESD and surge protection up to
24V.
Device Placement
Placement of the protection component is a critical ele-
ment for effective ESD suppression. TVS diodes should
be placed as close to the connector as possible. This
helps reduce transient coupling to nearby traces.
Figure 1 - USB 3.0 Type-A Protection Example
USB 3.0 - Type A
Host Connector
RClamp0512TQ
RClamp3324P
SSRX-
GND
SSRX+
D+
GND
SSTX-
D-
SSTX+
VBus
Via to Ground
Landing Pad
Device Outline
Trace
uClamp0571P
Figure 2 - Trace Routing
Line 1 In
Line 2 In
Line 3 In
Line 4 In
1
Trace
Land Pattern
Line 1 Out to IC
Line 2 Out to IC
Ground
Line 3 Out to IC
Line 4 Out to IC
Device
Via
RClamp3324P
Final Datasheet
Revision Date
Rev 6
June 9, 2015
www.semtech.com
5 of 8
Semtech
5 Page | ||
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| PDF Descargar | [ Datasheet RClamp3324P.PDF ] | |
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