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PDF RClamp7524T Data sheet ( Hoja de datos )

Número de pieza RClamp7524T
Descripción 4-Line ESD protection
Fabricantes Semtech 
Logotipo Semtech Logotipo



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No Preview Available ! RClamp7524T Hoja de datos, Descripción, Manual

PROTECTION PRODUCTS - RailClamp®
Description
RailClamp® TVS arrays are ultra low capacitance ESD
protection devices designed to protect high speed data
interfaces. This series has been specifically engineered
to protect sensitive components which are connected
to high-speed data and transmission lines from over-
voltage caused by ESD (electrostatic discharge), CDE
(Cable Discharge Events), and EFT (electrical fast
transients).
The RClamp®7524T will protect four lines or two
differential pairs. Each line has a maximum capaci-
tance of only 0.60pF between any I/O pin and ground.
This allows it to be used on circuits operating in excess
of 5GHz without signal attenuation. They feature high
maximum ESD withstand voltage of +/- 25kV contact,
+/-30kV air discharge per IEC 61000-4-2.
The RClamp7524T is in a 5-pin SLP1308N5T package.
It measures 1.3 x 0.8mm with a nominal height of
0.40mm. The innovative flow through package design
simplifies pcb layout and allows matched trace lengths
for consistant impedance between high speed differen-
tial lines.
The combination of small size, low capacitance, and high
level of ESD protection makes this device a flexible solu-
tion for applications such as HDMI, MHL, MDDI, and eDP
interfaces.
RClamp7524T
Low Capacitance RClamp®
4-Line ESD protection
PRELIMINARY
Features
ESD protection for high-speed data lines to
IEC 61000-4-2 (ESD) ±30kV (air), ±25kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects four high-speed lines
Low capacitance: 0.60pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.50 Ohms (Typ)
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP1308N5T 5-pin package (1.3 x 0.8 x 0.40mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.45mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications
HDMI 1.3 and HDMI 1.4
V-By-One
USB 3.0
MHL
eDP
LVDS Interfaces
eSATA Interfaces
Dimensions
Circuit Diagram
0.45 BSC
1.30
12
0.50 BSC
0.80
13
45
0.40
Nominal Dimensions in mm (Bottom View)
Revision 7/25/2013
1
2
4-Line Protection
www.semtech.com

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RClamp7524T pdf
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
1.05
RClamp7524T
PRELIMINARY
Stencil Opening (210x440 mm)
Land Pad (180x400 mm)
1.30
.25
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Recommended Mounting Pattern
© 2013 Semtech Corporation
5
www.semtech.com

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