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PDF CPC1979 Data sheet ( Hoja de datos )

Número de pieza CPC1979
Descripción Power Relay
Fabricantes Clare 
Logotipo Clare Logotipo



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No Preview Available ! CPC1979 Hoja de datos, Descripción, Manual

CPC1979
ISOPLUS™-264 Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
RθJC
Rating
600
3.5
1.4
0.75
0.3
Units
VP
Arms
Ω
°C/W
Features
3.5Arms Load Current with 5°C/W Heat Sink
Low 0.75Ω On-Resistance
600VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance (0.3 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Recognized Component: File E69938
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1979 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.5Arms continuous load current with a
5°C/W heat sink.
The CPC1979 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process in which the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation but also very low thermal
resistance (0.3 °C/W).
Ordering Information
Part
CPC1979J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
RoHS
2002/95/EC
DS-CPC1979 - R06
e3
IF
ILOAD
www.clare.com
90%
ton
10%
toff
1

1 page




CPC1979 pdf
PRELIMINARY
CPC1979
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40
Typical On-Resistance
vs. Temperature
(IF=20mA, IL=1A)
-20 0 20 40 60 80
Temperature (ºC)
100
700
690
680
670
660
650
640
630
620
610
600
-40
Typical Blocking Voltage
vs. Temperature
-20 0 20 40 60 80
Temperature (ºC)
100
2.5
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
-2.5
-1.5
Typical Load Current
vs. Load Voltage
(IF=10mA, TA=25ºC)
-1.0 -0.5
0 0.5
Load Voltage (V)
1.0
1.5
0.014
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=600VP)
0.012
0.010
0.008
0.006
0.004
0.002
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Maximum Load Current
vs. Temperature with Heat Sink
9 1ºC/W
8
(IF=20mA)
7
6
5
5ºC/W
4
3 10ºC/W
2 Free Air
1
0
0 20 40 60 80 100
Temperature (ºC)
Energy Rating Curve
Free Air, No Heat Sink
24
20
16
12
8
4
0
10µs 110µs 1ms 10ms 100ms 1s
Time
10s 100s
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.clare.com
R06

5 Page










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