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PDF CPC1906 Data sheet ( Hoja de datos )
| Número de pieza | CPC1906 | |
| Descripción | Relay | |
| Fabricantes | Clare | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de CPC1906 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
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Parameter
Blocking Voltage
Load Current
On-Resistance
Rating
60
2
0.3
Units
VP
ADC/Arms
Ω
Features
• Handle Load Currents Up to 2Arms
• 2500Vrms Input/Output Isolation
• Power SIP Package
• High Reliability
• No Moving Parts
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
CPC1906
Single-Pole, Normally Open
Power SIP OptoMOS® Relay
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability, and compact size to a new
family of high-power solid state relays. As part of that
family, the CPC1906 is a single-pole, normally open
(1-Form-A) solid state relay. The CPC1906 employs
optically coupled MOSFET technology to provide
2500Vrms of input to output isolation. The efficient
MOSFET switches and photovoltaic die use Clare’s
patented OptoMOS architecture while the output
is controlled by a highly efficient GaAlAs infrared
LED. The combination of low on-resistance and high
load current handling capabilities makes the relay
suitable for a variety of high-performance switching
applications.
Approvals
• UL 508 Certified Component: File E69938
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• IC Equipment
• Home Appliances
Ordering Information
Part #
Description
CPC1906Y 4-Pin (8-Pin Body) Power SIP Package (25 per tube)
Pin Configuration
12
-+
3
4
Pb
RoHS
2002/95/EC
e3
DS-CPC1906-R06
Switching Characteristics
of Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
www.clare.com
1
1 page  
CPC1906
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all
of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry
standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to
the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled
according to the limitations and information in that standard as well as to any limitations set forth in the information or
standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
CPC1906Y
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
CPC1906Y
Maximum Temperature x Time
245ºC for 30 seconds
Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. Since Clare employs the use of silicone coating as an optical waveguide in many of its optically isolated
products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes.
Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy
should not be used.
Pb
RoHS
2002/95/EC
e3
R06 www.clare.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet CPC1906.PDF ] | |
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