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CPC1908 fiches techniques PDF

Clare - Power Relay

Numéro de référence CPC1908
Description Power Relay
Fabricant Clare 
Logo Clare 





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CPC1908 fiche technique
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
RθJC
Rating
60
8.5
3.5
0.3
0.35
Units
VP
Arms
Ω
°C/W
Features
8.5Arms Load Current with 5°C/W Heat Sink
Low 0.3Ω On-Resistance
60VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance (0.35 °C/W)
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
Pin Configuration
CPC1908
Single-Pole, Normally Open
i4-PAC™ Power Relay
Description
Clare and IXYS have combined to bring OptoMOS®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1908 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 8.5Arms continuous load current with a
5°C/W heat sink.
The CPC1908 employs optically coupled MOSFET
technology to provide 2500Vrms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique i4-PAC package pioneered by IXYS
enables Solid State Relays to achieve the highest load
current and power ratings. This package features a
unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500Vrms isolation,
but also very low thermal resistance (0.35 °C/W).
Ordering Information
Part
CPC1908J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
RoHS
2002/95/EC
e3
DS-CPC1908 - R07
IF
ILOAD
www.clare.com
90%
ton
10%
toff
1

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