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2SB709 Fiches techniques |
Numéro de référence | Description détaillée | Fabricant | ||
10 | 2SB709 | GE PNP ALLOY JUNCTION(UL TYPE) | Panasonic Semiconductor |
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9 | 2SB709A | Plastic-Encapsulated Transistors Transys
Electronics
L I M I T E D
SOT-23 Plastic-Encapsulated Transistors
SOT-23
1. BASE 2. EMITTER
2SB709A
FEATURES Power dissipation PCM:
TRANSISTOR (PNP)
3. COLLECTOR
0.2
W (Tamb=25℃)
0. 95
1. 0
2. 4 1. 3
Collector | TRANSYS |
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8 | 2SB709A | Silicon PNP Epitaxial Transistor Transistor
2SB709A
Silicon PNP epitaxial planer type
For general amplification Complementary to 2SD601A
2.8 –0.3
+0.2
Unit: mm
s Features
q q
0.65±0.15
+0.25 1.5 –0.05
0.65±0.15
0.95
1.1 –0.1
+0.2
Collector to base voltage Collector | Panasonic Semiconductor |
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7 | 2SB709A | Silicon Epitaxial Planar Transistor BL Galaxy Electrical
Production specification
Silicon Epitaxial Planar Transistor
High forward current transfer ratio hFE. Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing | Galaxy Semi-Conductor Holdings Limited |
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6 | 2SB709A | PNP Silicon General Purpose Transistor Elektronische Bauelemente
2SB709A
-0.2A , -45V PNP Silicon General Purpose Transistor
RoHS Compliant Product A suffix of “-C” specifies halogen and lead free
FEATURES
For general amplification Complementary of the 2SD601A
CLASSIFICATION OF hF | SeCoS |
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5 | 2SB709A | BIPOLAR PNP TRANSISTOR RECTRON
SEMICONDUCTOR
TECHNICAL SPECIFICATION
SOT-23 BIPOLAR TRANSISTORS TRANSISTOR(PNP)
FEATURES
* Power dissipation
PCM :
0.2
W(Tamb=25OC)
2SB709A
MECHANICAL DATA
* Case: Molded plastic
* Epoxy: UL 94V-O rate flame retardant
* Lead: MIL-STD- | Rectron |
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4 | 2SB709A | SILICON PNP TRANSISTOR 2SB709A(3CG709A)
硅 PNP 半导体三极管/SILICON PNP TRANSISTOR
用途:用于普通功率放大/Purpose: General power amplifier applications. 特点:与 2SD601A(3DG601A)互补/Features:Complementary pair with 2SD601A(3DG601A).
极限参数/Abs | LZG |
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3 | 2SB709A | PNP Transistors SMD Type
TransistIoCrs
Silicon PNP Epitaxial Planar Type 2SB709A
Features
High forward current transfer ratio hFE. Mini type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing.
| Kexin |
Numéro de référence | Description détaillée | Fabricant | |
ASJD1200R085 | Normally-ON Trench Silicon Carbide Power JFET |
Micross |
|
B8524 | SAW Components |
TDK |
|
BA6343 | Stepping motor driver |
ROHM |
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